SKY66008-11RF/IF射頻/中頻RFID的射頻放大器規(guī)格書PDF中文資料

SKY66008-11屬于RF/IF射頻/中頻RFID的射頻放大器。由美國思佳訊公司制造生產(chǎn)的SKY66008-11射頻放大器在射頻應(yīng)用中，射頻放大器產(chǎn)品可用于信號增益和緩沖。這些產(chǎn)品與通用運算放大器的不同之處在于，它們通常適用于更高的頻率，更傾向于提供不可調(diào)節(jié)的固定增益，并且輸入或輸出阻抗值符合常用傳輸線特性阻抗。

Applications

? Residential femtocells

? WCDMA, Band 8

? Small cells

Features

? Small signal gain: 28.5 dB

? ACLR at POUT = +19 dBm: -54 dBc

? PA on/off control

? I/O impedance internally matched to 50 Ω

? Single DC supply: 3.3 V to 4.6 V

? Minimal number of external components required

? Small footprint MCM (10-pin, 3 x 3 mm) package (MSL3, 260 °C per JEDEC J-STD-020)

Description

The SKY66008-11 linear power amplifier (PA) is a fully matched surface-mount module developed for WCDMA applications operating from 900 to 990 MHz. The device meets the stringent spectral linearity requirements of WCDMA femtocell applications with high power-added efficiency. An integrated directional coupler eliminates the need for any external coupler.

The GaAs MMIC contains all active amplifier circuitry, which includes input and interstage matching circuits. An output match into a 50 Ω load, realized off-chip within the module package, optimizes efficiency and power performance.

The SKY66008-11 is manufactured with Skyworks InGaP GaAs HBT process, which provides for all positive voltage DC supply operation and maintains high efficiency and good linearity. The primary bias to the device can be supplied directly from any suitable power supply with an output of 4.2 V. Power down is achieved by setting the VEN pin to 0 V. No external supply side switch is needed since typical “off” leakage is a few microamps with full primary voltage supplied from the main power supply.

The SKY66008-11 is packaged in a 10-pin, 3 x 3 mm Multi-Chip Module (MCM), which allows for a highly manufacturable low-cost solution.

A functional block diagram of the SKY66008-11 is shown in Figure 1. The 10-pin MCM package and pinout are shown in Figure 2. Signal pin assignments and functional pin descriptions are provided in Table 1.