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SLG47105V中文資料瑞薩數(shù)據(jù)手冊(cè)PDF規(guī)格書(shū)

SLG47105V
廠商型號(hào)

SLG47105V

參數(shù)屬性

SLG47105V 封裝/外殼為20-UFQFN 裸露焊盤(pán);包裝為卷帶(TR)剪切帶(CT)Digi-Reel? 得捷定制卷帶;類別為集成電路(IC) > 專用 IC;SLG47105V應(yīng)用范圍:負(fù)載驅(qū)動(dòng),電機(jī)驅(qū)動(dòng);產(chǎn)品描述:GPAK MIXED SIGNAL MATRIX

功能描述

GreenPAK Programmable Mixed-Signal Matrix with High Voltage Features

文件大小

4.23609 Mbytes

頁(yè)面數(shù)量

253 頁(yè)

生產(chǎn)廠商 Renesas Technology Corp
企業(yè)簡(jiǎn)稱

RENESAS瑞薩

中文名稱

瑞薩科技有限公司官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

更新時(shí)間

2024-11-15 23:03:00

SLG47105V規(guī)格書(shū)詳情

Key Features

? Two Power Supply Inputs:

? 2.5 V (±8 ) to 5.0 V (±10 ) VDD

? 3.3 V (±9 ) to 12.0 V (±10 ) VDD2

? Four High Voltage High Current Drive GPOs

? Dual/Single Full Bridge Driver Option

? Quad/Dual/Single Half Bridge Driver Option

? Slew Rate Modes:

? Motor Driver Mode

? Pre-Driver (MOSFET Driver) Mode

? SLEEP Function

? Low RDS ON High Side + Low Side resistance = 0.4 W

? 2 A Peak, 1.5 A RMS per Full Bridge (at VDD2 = 5 V,

T = 25 °C) (Note 1)

? 4 A Peak, 3 A RMS per two Full Bridge connected in

parallel (at VDD2 = 5 V, T = 25 °C) (Note 1)

? 2 A Peak, 1.5 A RMS per Half Bridge GPO

(at VDD2 = 5 V, T = 25 °C) (Note 1)

? Integrated Protections:

?Over Current Protection (OCP)

?Short Circuit Protection

?Under-Voltage Lockout (UVLO)

?Thermal Shutdown (TSD)

? SENSE_A, SENSE_B Inputs that are connected to the

Current Comparators for Current Control

? Fault Signal Indicator individual per Full Bridge:

?OCP

?UVLO

?TSD

? Differential Amplifier with Integrator and Comparator for Motor Speed Control Function

? Two Current Sense Comparators with Dynamical Vref Mode

? Two High-Speed General Purpose ACMPs

? Modes: UVLO, OCP, TSD, Voltage Monitor, Current Monitor

產(chǎn)品屬性

  • 產(chǎn)品編號(hào):

    SLG47105V

  • 制造商:

    Dialog Semiconductor GmbH

  • 類別:

    集成電路(IC) > 專用 IC

  • 包裝:

    卷帶(TR)剪切帶(CT)Digi-Reel? 得捷定制卷帶

  • 類型:

    混合信號(hào)陣列

  • 應(yīng)用:

    負(fù)載驅(qū)動(dòng),電機(jī)驅(qū)動(dòng)

  • 安裝類型:

    表面貼裝型

  • 封裝/外殼:

    20-UFQFN 裸露焊盤(pán)

  • 供應(yīng)商器件封裝:

    20-STQFN(2x3)

  • 描述:

    GPAK MIXED SIGNAL MATRIX

供應(yīng)商 型號(hào) 品牌 批號(hào) 封裝 庫(kù)存 備注 價(jià)格
SILEGO
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DIALOG
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Renesas Electronics Corporatio
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589220
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SILEGO
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