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SPAL00340

Automotive Ignition Avalanche Diode

SIPOWER

SiPower Inc.

SPAL00340L

Automotive Ignition Avalanche Diode

SIPOWER

SiPower Inc.

SPAL00340LF

General Purpose Rectifier

SIPOWER

SiPower Inc.

ACDBQC00340-HF

SMDSchottkyBarrierDiode

Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowstoredcharge. -Majoritycarrierconduction. -AEC-Q101Qualified.

COMCHIPComchip Technology

典琦典琦科技股份有限公司

ASB00340

SMDSchottkyBarrierDiode

Features IO=30mA VR=40V -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowcapacitance. -Majoritycarrierconduction -Lead-freedevice

ANACHIPAnachip Corp

易亨電子易亨電子股份有限公司

CDBER00340

SMDSchottkyBarrierDiode

Io=30mA VR=40Volts RoHSDevice Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowstoredcharge. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-7

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBER00340-HF

SMDSchottkyBarrierDiode

Io=30mA VR=40Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowstoredcharge. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderable

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF00340

SMDSchottkyBarrierDiode

Io=30mA VR=40Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowcapacitance. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-75

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF00340-HF

SMDSchottkyBarrierDiode

Io=30mA VR=40Volts Features Designedformountingonsmallsurface. Extremelythinpackage. Lowstoredcharge. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR00340

SMDSchottkyBarrierDiode

Io=30mA VR=40Volts Features Designedformountingonsmallsurface. Extremelythinpackage. Lowstoredcharge. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Goldplated,solderablep

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR00340-HF

SMDSchottkyBarrierDiode

Io=30mA VR=40Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowstoredcharge. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Goldplated,solder

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBN00340

SMDSchottkyBarrierDiode

Io=30mA VR=40Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:12063(3216)Standardpackage,moldedplastic. Terminals:Solderplated,solderableperMIL-STD-750,method20

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBP00340

SMDSchottkyBarrierDiode

ReverseVoltage:30Volts ForwardCurrent:30mA Features: ?SmallSurfaceMountingType ?HighReliability ?LowReverseCurrentandLowForwardVoltage MechanicalData: ?Case:MoldedplasticSOD-723 ?Terminals:SolderableperMIL-STD-750,Method2026.1. ?Polarity:Indicatedbycathod

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBP00340-HF

SMDSchottkyBarrierDiode

Features -Smallsurfacemountingtype. -Highreliability. -Lowreversecurrentandlowforwardvoltage.

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBQC00340-HF

SMDSchottkyBarrierDiode

Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowstoredcharge. -Majoritycarrierconduction.

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBQR00340

SMDSchottkyBarrierDiode

Io=30mA VR=40Volts Features Designedformountingonsmallsurface. Extremelythinpackage. Lowstoredcharge. Majoritycarrierconduction. Mechanicaldata Case:0402(1005)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBQR00340-HF

SMDSchottkyBarrierDiode

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBQR00340-HF

SMDSchottkyBarrierDiode

Io=30mA VR=40Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowstoredcharge. -Majoritycarrierconduction. Mechanicaldata -Case:0402/SOD-923Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderable

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBS00340

SMDSchottkyBarrierDiode

Io=30mA VR=40Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:0805(2012)Standardpackage,moldedplastic. Terminals:Solderplated,solderableperMIL-STD-750,method20

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBU00340

SMDSchottkyBarrierDiode

Io=30mA VR=40Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowcapacitance. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-75

COMCHIPComchip Technology

典琦典琦科技股份有限公司

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更多SPAL00340供應(yīng)商 更新時(shí)間2024-12-22 15:48:00