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ST1305B中文資料意法半導(dǎo)體數(shù)據(jù)手冊(cè)PDF規(guī)格書

ST1305B
廠商型號(hào)

ST1305B

功能描述

Memory Micromodules General Information for D1, D2 and C Packaging

文件大小

277.48 Kbytes

頁面數(shù)量

13

生產(chǎn)廠商 STMicroelectronics
企業(yè)簡稱

STMICROELECTRONICS意法半導(dǎo)體

中文名稱

意法半導(dǎo)體(ST)集團(tuán)官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二原廠數(shù)據(jù)手冊(cè)到原廠下載

更新時(shí)間

2024-11-17 22:59:00

ST1305B規(guī)格書詳情

DESCRIPTION

Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip).

■ Micromodules were developed specifically for

embedding in Smartcards and Memory Cards

■ The Micromodule provides:

– Support for the chip

– Electrical contacts

– Suitable embedding interface for gluing the

module to the plastic package

■ Physical dimensions and contact positions

compliant to the ISO 7816 standard

■ Micromodules delivered as a continuous Super

35 mm tape. (This differs from the standard

35 mm tape in the spacing distance between

the indexing holes.)

產(chǎn)品屬性

  • 型號(hào):

    ST1305B

  • 制造商:

    STMICROELECTRONICS

  • 制造商全稱:

    STMicroelectronics

  • 功能描述:

    Memory Micromodules General Information for D1, D2 and C Packaging

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