首頁>STGB30H60DLFB>規(guī)格書詳情

STGB30H60DLFB中文資料意法半導(dǎo)體數(shù)據(jù)手冊PDF規(guī)格書

STGB30H60DLFB
廠商型號

STGB30H60DLFB

功能描述

Trench gate field-stop IGBT, HB series 600 V, 30 A high speed

絲印標(biāo)識

GB30H60DLFB

封裝外殼

D2PAK

文件大小

1.74476 Mbytes

頁面數(shù)量

20

生產(chǎn)廠商 STMicroelectronics
企業(yè)簡稱

STMICROELECTRONICS意法半導(dǎo)體

中文名稱

意法半導(dǎo)體集團(tuán)官網(wǎng)

原廠標(biāo)識
數(shù)據(jù)手冊

下載地址一下載地址二到原廠下載

更新時(shí)間

2025-5-6 23:00:00

人工找貨

STGB30H60DLFB價(jià)格和庫存,歡迎聯(lián)系客服免費(fèi)人工找貨

STGB30H60DLFB規(guī)格書詳情

Description

These devices are IGBTs developed using an

advanced proprietary trench gate and field stop

structure. The device is part of the new HB

series of IGBTs, which represent an optimum

compromise between conduction and switching

losses to maximize the efficiency of any

frequency converter. Furthermore, a slightly

positive VCE(sat) temperature coefficient and very

tight parameter distribution result in safer

paralleling operation.

Features

? Designed for soft commutation only

? Maximum junction temperature: TJ = 175 °C

? High speed switching series

? Minimized tail current

? VCE(sat) = 1.55 V (typ.) @ IC = 30 A

? Low VF soft recovery co-packaged diode

? Tight parameters distribution

? Safe paralleling

? Low thermal resistance

? Lead free package

Applications

? Microwave oven

? Resonant converters

供應(yīng)商 型號 品牌 批號 封裝 庫存 備注 價(jià)格
ST(意法半導(dǎo)體)
24+
TO-263-3
1612
原廠訂貨渠道,支持BOM配單一站式服務(wù)
詢價(jià)
STMicroelectronics
24+
TO-263-3,D2Pak(2 引線 + 接片
30000
晶體管-分立半導(dǎo)體產(chǎn)品-原裝正品
詢價(jià)
ST
25+
D2PAK
18000
全新原裝
詢價(jià)
ST/意法半導(dǎo)體
21+
D2PAK-3
8860
原裝現(xiàn)貨,實(shí)單價(jià)優(yōu)
詢價(jià)
ST/意法半導(dǎo)體
21+
D2PAK-3
8860
只做原裝,質(zhì)量保證
詢價(jià)
ST/意法
23+
TO-263
11200
原廠授權(quán)一級代理、全球訂貨優(yōu)勢渠道、可提供一站式BO
詢價(jià)
ST/意法半導(dǎo)體
21+
D2PAK-3
13880
公司只售原裝,支持實(shí)單
詢價(jià)
ST/意法半導(dǎo)體
23+
D2PAK-3
6000
我們只做原裝正品,支持檢測。
詢價(jià)
ST
22+
D2PAK
9000
原廠渠道,現(xiàn)貨配單
詢價(jià)
ST/意法半導(dǎo)體
23+
D2PAK-3
12820
正規(guī)渠道,只有原裝!
詢價(jià)