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STM32WB55EGV6ATR中文資料意法半導(dǎo)體數(shù)據(jù)手冊(cè)PDF規(guī)格書(shū)

STM32WB55EGV6ATR
廠商型號(hào)

STM32WB55EGV6ATR

功能描述

Multiprotocol wireless 32-bit MCU Arm?-based Cortex?-M4 with FPU, Bluetooth? 5.3 and 802.15.4 radio solution

文件大小

3.05881 Mbytes

頁(yè)面數(shù)量

196 頁(yè)

生產(chǎn)廠商 STMicroelectronics
企業(yè)簡(jiǎn)稱(chēng)

STMICROELECTRONICS意法半導(dǎo)體

中文名稱(chēng)

意法半導(dǎo)體集團(tuán)官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

更新時(shí)間

2025-1-22 8:30:00

STM32WB55EGV6ATR規(guī)格書(shū)詳情

Features

? Include ST state-of-the-art patented

technology

? Radio

– 2.4 GHz

– RF transceiver supporting Bluetooth? 5.3

specification, IEEE 802.15.4-2011 PHY

and MAC, supporting Thread and

Zigbee? 3.0

– RX sensitivity: -96 dBm (Bluetooth? Low

Energy at 1 Mbps), -100 dBm (802.15.4)

– Programmable output power up to +6 dBm

with 1 dB steps

– Integrated balun to reduce BOM

– Support for 2 Mbps

– Support advertising extension

– Dedicated Arm? 32-bit Cortex? M0+ CPU

for real-time Radio layer

– Accurate RSSI to enable power control

– Suitable for systems requiring compliance

with radio frequency regulations ETSI EN

300 328, EN 300 440, FCC CFR47 Part 15

and ARIB STD-T66

– Support for external PA

– Available integrated passive device (IPD)

companion chip for optimized matching

solution (MLPF-WB-01E3, or

MLPF-WB55-02E3, or MLPF-WB-02D3)

? Ultra-low-power platform

– 1.71 to 3.6 V power supply

– – 40 °C to 85 / 105 °C temperature ranges

– 13 nA shutdown mode

– 600 nA Standby mode + RTC + 32 KB RAM

– 2.1 μA Stop mode + RTC + 256 KB RAM

– Active-mode MCU: < 53 μA / MHz when RF and SMPS on

– Radio: Rx 4.5 mA / Tx at 0 dBm 5.2 mA

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