T0050101599焊接拆焊返修產(chǎn)品的焊接拆焊返修尖頭噴嘴規(guī)格書PDF中文資料

Benefits

Short tip-to-grip distance Close

working distance to the component

for higher precision and maximum

control

MIL-SPC / IPC standard (potential free)

Reduces risk of damage to sensitive

micro components and workpieces.

No rework, lower total cost of

ownership

Active tip technology Fastest heat-up

and recovery time, sensor close to the

solder tip, excellent heat transfer. No

downtime, continuing workflow,

excellent results

Digital tool for data storage Motion

activated usage sensor for energy

control and data storage

Patented tip & grip design Only

soldering tip on the market which can

be changed without a tool. 20 faster

change than leading competitors.