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T763TS

T4/T7 Series NEMA 4X, 7/9 Temperature Switches

FEATURES PrecisionSPDTorDPDTsnap-actingmicroswitchoperation Singlesetpointadjustablefrom0-100%ofrange Fixedorlimitedadjustabledeadband Internalsetpointlockingscrew(T4) Directorremotereadingthermalsystems Choiceoftemperatureranges(from-40°Fto750°F) Exp

ASHCROFT

Ashcroft, Inc.

AIMB-763

Intel?LGA775Core??2Duo/Pentium?4/ATXwithVGA,4COM,SWRAID,andDualLAN

ADVANTECHAdvantech Co., Ltd.

研華科技研華科技（中國）有限公司

AN-763

DualUniversalPrecisionOpAmpEvaluationBoard

ADAnalog Devices

亞德諾亞德諾半導(dǎo)體技術(shù)有限公司

AXC763-C

AXC763NetgearCompatibleDirectAttachCopperTwinaxCable10GSFPCu(3m,Passive)

Features ATGBICSAXC763compatible10GBase-CUSFP+toSFP+directattachcableoperatesoverpassivecopperwitha?cablelengthof3m. ItissuitableforshortreachconnectionbetweentwoSFP+portsin10Ginterconnectingnetworkingapplications. ?OurproductmeetsthespecificationofNetgear

ATGBICS

ATGBICS by Approved Technology

AZ763

12ASPDTMINIATUREPOWERRELAY

FEATURES ?Dielectricstrength5000Vrms ?Lowheight:15.7mm ?Epoxysealedversionavailable ?12Ampswitching ?ACandDCcoils ?Isolationspacinggreaterthan10mm ?Prooftrackingindex(PTI/CTI)250 ?Reinforcedinsulation,EN60730-1(VDE0631,part1)EN60335-1

ZETTLER

ZETTLER Electronics

AZ763

12ASPDTMINIATUREPOWERRELAY

FEATURES ?Dielectricstrength5000Vrms ?Lowheight:15.7mm ?Epoxysealedversionavailable ?12Ampswitching ?ACandDCcoils ?Isolationspacinggreaterthan10mm ?Prooftrackingindex(PTI/CTI)250 ?SurpassesrequirementsofVDE0631/0700 ?UL,CURfileE4320

AZETTLERAmerican Zettler, Inc.

美國賽特勒

AZ763

12ASPDTMINIATUREPOWERRELAY

ZETTLER

ZETTLER Electronics

BF763

NPN2GHzwidebandtransistor

DESCRIPTION NPNtransistorinaplasticSOT54(TO-92variant)envelope. ItisprimarilyintendedforuseinRFamplifiersandoscillators.

PhilipsNXP Semiconductors

飛利浦荷蘭皇家飛利浦

BF763

NPN2GHzwidebandtransistor

DESCRIPTION NPNtransistorinaplasticSOT54(TO-92variant)envelope. ItisprimarilyintendedforuseinRFamplifiersandoscillators. ???????

NJSEMINew Jersey Semi-Conductor Products, Inc.

新澤西半導(dǎo)體新澤西半導(dǎo)體產(chǎn)品股份有限公司

CP763V

PowerTransistorPNP-HighCurrentTransistorChip

PROCESSDETAILS ??????? DieSize48.8x48.8MILS DieThickness7.1MILS BaseBondingPadArea7.9x7.9MILS EmitterBondingPadArea9.1x18.1MILS TopSideMetalizationAl-30,000? BackSideMetalizationTi/Ni/Ag-2,000?/3,000?/20,000?

CentralCentral Semiconductor Corp

美國中央半導(dǎo)體

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原裝現(xiàn)貨假一罰十
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9
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2020+
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36728
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1850
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300
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更多T763TS供應(yīng)商 更新時(shí)間2025-4-17 8:00:00

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