TDGL021

包裝：盒 類別：開發(fā)板，套件，編程器 射頻評估和開發(fā)套件，開發(fā)板 描述：BOARD DEV CHIPKIT WF32 WI-FI

TDGL021-2

包裝：散裝 類別：開發(fā)板，套件，編程器 射頻評估和開發(fā)套件，開發(fā)板 描述：DEV BOARD CHIPKIT WI-FIRE

TL021

FIXED-RATION-P-NCURRENTMIRRORS

TR021

MoldedInductors,AxialLeadsHighFrequencyandNoiseSuppressionApplications

TR021

MoldedInductors,AxialLeads,HighFrequencyandNoiseSuppressionApplications

FEATURES ?Accuratedimensions ?Superiormoistureprotection ?Materialcategorization:fordefinitionsof compliancepleaseseewww.vishay.com/doc?99912

TS-021

PUSHMINISMD2.5MM2PINES

Descripción Estospeque?osinterruptorescomúnmentellamadospush-buttonsonutilizadosenlamayoríadeproyectosdeelectrónicayrobótica,sonnormalmenteabiertosesdecirquecuandosepulsaelbotónunavezestecierramomentáneamenteelcircuitoenelqueseencuentre,sonutilizadossobre

TSA021

FlybackTransformerSurfaceMountMagnetics

TTC021

BipolarTransistorsSiliconNPNEpitaxialType

Applications ?High-SpeedSwitching ?DC-DCConverters Features (1)HighDCcurrentgain:hFE=120to240(VCE=2V,IC=0.3A) (2)Lowcollector-emittersaturationvoltage:VCE(sat)=0.15V(max)(IC=1.0A,IB=0.1A) (3)High-speedswitching:tf=170ns(typ.)(IC=1.0A)

V021V

GaugeValve-V02Series

FEATURES Isolatesprocessfrominstrumentassembly 316LStainlesssteelconstruction

VS021

PleasereadthisnoticebeforeusingtheTAIYOYUDENproducts.