TI60F225C3L集成電路（IC）的FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列）規(guī)格書(shū)PDF中文資料

Features

? High-density, low-power Quantum? compute fabric

? Built on TSMC 16 nm process

? 10-kbit high-speed, embedded SRAM, configurable as single-port RAM, simple dual-port

RAM, true dual-port RAM, or ROM

? High-performance DSP blocks for multiplication, addition, subtraction, accumulation,

and up to 15-bit variable-right-shifting

? Versatile on-chip clocking

— Low-skew global network supporting 32 clock or control signals

— Regional and local clock networks

— PLL support

? FPGA interface blocks

— High-voltage I/O (HVIO) (1.8, 2.5, 3.3 V)

— High-speed I/O (HSIO), configurable as:

– LVDS, subLVDS, Mini-LVDS, and RSDS (RX, TX, and bidirectional), up to

1.5 Gbps

– MIPI lane I/O (DSI and CSI) in high-speed (HS) low-power (LP) modes, up to

1.5 Gbps

– Single-ended and differential I/O

— PLL

— Oscillator

? Flexible device configuration

— Standard SPI interface (active, passive, and daisy chain(1))

— JTAG interface

— Supports internal reconfiguration

? Single-event upset (SEU) detection feature

? Fully supported by the Efinity? software, an RTL-to-bitstream compiler

? Optional security feature

— Asymmetric bitstream authentication using RSA-4096

— Bitstream encryption/decryption using AES-GCM