TLP754中文資料東芝數(shù)據(jù)手冊(cè)PDF規(guī)格書(shū)

General

The TLP754 is a photocoupler in a DIP8 package that consists of a GaA?As infrared light-emitting diode (LED) optically coupled to an integrated high-gain, high-speed photodetector IC chip. It provides guaranteed performance and specifications at temperatures up to 125°C. An internal noise shield provides a guaranteed common mode transient immunity of ±20 kV/μs. The TLP754 guarantees minimum and maximum of propagation delay time, pulse width distortion. Therefore it is suitable for isolation interface between IPM and control IC circuits in motor control application.

Features

(1) Inverter logic type (open collector output)

(2) Package: DIP8

(3) Operating temperature: -40 to 125°C 

(4) Supply voltage: -0.5 to 30 V

(5) Threshold input current: 5.0 mA (max)

(6) Supply current: 1.3 mA (max)

(7) Propagation delay time: tpHL = 400 ns (max), tpLH = 550 ns (max)

(8) Pulse width distortion: 400 ns (max)

(9) Common-mode transient immunity: ±20 kV/μs (min)

(10) Isolation voltage: 5000 Vrms (min)

(11) Safety standards

UL-approved: UL1577, File No.E67349

cUL-approved: CSA Component Acceptance Service No.5A File No.E67349

VDE-approved: EN60747-5-5, EN60065 or EN60950-1 (Note 1)

Note 1: When a VDE approved type is needed, please designate the Option (D4).

Applications

? Intelligent Power Module Signal Isolation

? Factory Automation (FA)

? Industrial Inverters