首頁>TPSKA6M50B00-R3_V01>規(guī)格書詳情
TPSKA6M50B00-R3_V01中文資料村田數(shù)據(jù)手冊PDF規(guī)格書
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TPSKA6M50B00-R3_V01規(guī)格書詳情
Features
1. High attenuation and high performance group delay time
2. Small and thin package
3. Reflow-solderable