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TPSM63610中文資料德州儀器數(shù)據(jù)手冊(cè)PDF規(guī)格書

TPSM63610
廠商型號(hào)

TPSM63610

功能描述

TPSM63610 High-Density, 3-V to 36-V Input, 1-V to 20-V Output, 8-A (10-A Peak) Synchronous Buck DC/DC Power Module With Enhanced HotRod? QFN Package

文件大小

1.9065 Mbytes

頁(yè)面數(shù)量

38 頁(yè)

生產(chǎn)廠商 Texas Instruments
企業(yè)簡(jiǎn)稱

TI德州儀器

中文名稱

美國(guó)德州儀器公司官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

更新時(shí)間

2025-1-16 18:32:00

TPSM63610規(guī)格書詳情

1 Features

? Functional Safety-Capable

– Documentation available to aid functional safety

system design

? Versatile 36-VIN, 8-AOUT synchronous buck module

– Integrated MOSFETs, inductor, and controller

– Adjustable output voltage from 1 V to 20 V

– 6.5-mm × 7.5-mm × 4-mm overmolded package

– –40°C to 125°C junction temperature range

– Frequency adjustable from 200 kHz to 2.2 MHz

– Negative output voltage capability

? Ultra-high efficiency across the full load range

– 95+ peak efficiency

– External bias option for improved efficiency

– Exposed Pad for low thermal impedance. EVM

θ JA = 18.2 °C/W.

– Shutdown quiescent current of 0.6 μA (typical)

? Ultra-low conducted and radiated EMI signatures

– Low-noise package with dual input paths and

integrated capacitors reduces switch ringing

– Resistor-adjustable switch-node slew rate

– Meets CISPR 11 and 32 Class B emissions

? Suitable for scalable power supplies

– Pin compatible with the TPSM63608 (36 V, 6 A)

? Inherent protection features for robust design

– Precision enable input and open-drain PGOOD

indicator for sequencing, control, and VIN UVLO

– Overcurrent and thermal shutdown protections

? Create a custom design using the TPSM63610

with the WEBENCH? Power Designer

2 Applications

? Test and measurement, aerospace and defense

? Factory automation and control

? Buck and inverting buck-boost power supplies

3 Description

Deriving from a family of synchronous buck modules,

the TPSM63610 is a highly integrated 36-V, 8-A

DC/DC solution that combines power MOSFETs, a

shielded inductor, and passives in an Enhanced

HotRod? QFN package. The module has VIN and

VOUT pins located at the corners of the package

for optimized input and output capacitor placement.

Four larger thermal pads beneath the module enable

a simple layout and easy handling in manufacturing.

With an output voltage from 1 V to 20 V, the

TPSM63610 is designed to quickly and easily

implement a low-EMI design in a small PCB footprint.

The total solution requires as few as four external

components and eliminates the magnetics and

compensation part selection from the design process.

Although designed for small size and simplicity

in space-constrained applications, the TPSM63610

module offers many features for robust performance:

precision enable with hysteresis for adjustable inputvoltage

UVLO, resistor-programmable switch node

slew rate and spread spectrum and spread spectrum

option for improved EMI. Along with integrated VCC,

bootstrap and input capacitors for increased reliability

and higher density. The module can be configured

for constant switching frequency over the full load

current range (FPWM), or variable frequency (PFM)

for higher light load efficiency. Including a PGOOD

indicator for sequencing, fault protection, and output

voltage monitoring.

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TI
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