零件編號(hào) | 下載&訂購(gòu) | 功能描述 | 制造商&上傳企業(yè) | LOGO |
---|---|---|---|---|
AMCCSeriesCutCoreFINEMET?F3CCSeriesCutCore | ETCList of Unclassifed Manufacturers 未分類制造商 | ETC | ||
SMDSchottkyBarrierDiode Features IO=350mA VR=20Vto40V -Lowforwardvoltage -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated | ANACHIPAnachip Corp 易亨電子易亨電子股份有限公司 | ANACHIP | ||
SMDSchottkyBarrierDiode Features IO=350mA VR=20Vto40V -Lowforwardvoltage -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated | ANACHIPAnachip Corp 易亨電子易亨電子股份有限公司 | ANACHIP | ||
SMDSchottkyBarrierDiode Features IO=350mA VR=20Vto40V -Lowforwardvoltage -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated | ANACHIPAnachip Corp 易亨電子易亨電子股份有限公司 | ANACHIP | ||
Highreliabilitytomechanicalstress | ABRACON Abracon Corporation | ABRACON | ||
Single-EndedCordsets Basicfeatures Approval/ConformityCE cULus EAC WEEE | BalluffBalluff Korea Ltd. 巴魯夫巴魯夫集團(tuán) | Balluff | ||
SMDSchottkyBarrierDiode IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Gold | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode IO=350mA VR=20to40Volts Features Halogenfree. Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplat | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Gol | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=350mA VR=20to40Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals: | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage, moldedplastic. Terminals:Gol | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=350mA VR=20to40Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Gol | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage, moldedplastic. Terminals:Gold | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=350mA VR=20to40Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Gol | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
Dimming/ConnectorType | TDKTDK Corporation TDK株式會(huì)社東電化(中國(guó))投資有限公司 | TDK | ||
DC-ACINVERTERUNIT5WDUALOUTPUTSWITHDIMMINGFUNCTION | POWER-SYSTEMS Power Systems GmbH+Co.KG | POWER-SYSTEMS | ||
0.3AmpSiliconControlledRectifiersVOID-FREEGLASSPASSIVATEDCHIPS | FCIFirst Components International 戈采戈采企業(yè)股份有限公司 | FCI | ||
0.3AmpSiliconControlledRectifiersMechanicalDimensions | FCIFirst Components International 戈采戈采企業(yè)股份有限公司 | FCI | ||
EMI/EMCFILTER Features -Ideallysuitedforproductsthatmustconformtopart 15,FCCregulations -Metalcasedminiaturetypewithhighperformance -MeetovervoltagecategoryIlof[EC60664andcomply withIEC60950 -UsesIECconnectorthatmeetsthesafetystandards fromcertificationbodies -So | DIT DONG IL TECHNOLOGY LTD. | DIT |
供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫存 | 備注 | 價(jià)格 |
---|---|---|---|---|---|---|---|
EMC-RFLABS |
23+ |
NA |
9808 |
進(jìn)口代理原裝優(yōu)勢(shì)供應(yīng)全系列可訂貨QQ1304306553 |
詢價(jià) | ||
EMC |
24+ |
172 |
詢價(jià) | ||||
EMCT |
24+ |
SMD |
1680 |
一級(jí)代理原裝進(jìn)口現(xiàn)貨 |
詢價(jià) | ||
EMC RFLABS |
21+ |
TSSOP-B8J |
980 |
全新原裝鄙視假貨15118075546 |
詢價(jià) | ||
EMC-RFLABS |
CHIP |
22+ |
56000 |
全新原裝進(jìn)口,假一罰十 |
詢價(jià) | ||
Smiths |
24+ |
原裝原封 |
25000 |
##公司100%原裝現(xiàn)貨,假一罰十!可含稅13%免費(fèi)提供樣品支持 |
詢價(jià) | ||
EMC |
18+ |
3000 |
只做原裝假一罰十 |
詢價(jià) | |||
EMC |
2021+ |
3000 |
十年專營(yíng)原裝現(xiàn)貨,假一賠十 |
詢價(jià) | |||
EMC/杰力 |
2122+ |
NA |
24550 |
全新原裝正品現(xiàn)貨,假一賠十 |
詢價(jià) | ||
EMC/杰力 |
2023+ |
Chip |
1000 |
專注全新正品,優(yōu)勢(shì)現(xiàn)貨供應(yīng) |
詢價(jià) |
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