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TZ0340A

SMD 4.0x2.5 13.6MHz Crystal Unit

Features: SurfaceMountSeamWeldPackage ExcellentAging ExcellentESRperformance UltraMiniaturePackage DescriptionandApplications: Surfacemount4.0mmx2.5mmcrystalunitforuseinwirelesstelecommunicationsdevices, especiallyforaneedofultraminiaturepackageformobility.

TAI-SAW

TAI-SAW TECHNOLOGY CO., LTD.

0340

NylonPush-InandThickPanelPush-InFasteners

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ASB0340

SMDSchottkyBarrierDiode

Features IO=350mA VR=20Vto40V -Lowforwardvoltage -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated

ANACHIPAnachip Corp

易亨電子易亨電子股份有限公司

ASB0340BD

SMDSchottkyBarrierDiode

Features IO=350mA VR=20Vto40V -Lowforwardvoltage -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated

ANACHIPAnachip Corp

易亨電子易亨電子股份有限公司

ASB0340BF

SMDSchottkyBarrierDiode

Features IO=350mA VR=20Vto40V -Lowforwardvoltage -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated

ANACHIPAnachip Corp

易亨電子易亨電子股份有限公司

CDBF0340

SMDSchottkyBarrierDiode

IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Gold

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0340-HF

SMDSchottkyBarrierDiode

IO=350mA VR=20to40Volts Features Halogenfree. Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplat

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0340

SMDSchottkyBarrierDiode

IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Gol

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0340-HF

SMDSchottkyBarrierDiode

Io=350mA VR=20to40Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBU0340

SMDSchottkyBarrierDiode

IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage, moldedplastic. Terminals:Gol

COMCHIPComchip Technology

典琦典琦科技股份有限公司

供應(yīng)商型號(hào)品牌批號(hào)封裝庫(kù)存備注價(jià)格
TST
23+
-
1000
華南總代
 詢價(jià)
TAISAW
24+
SMD
880000
明嘉萊只做原裝正品現(xiàn)貨
 詢價(jià)
24+
N/A
47000
一級(jí)代理-主營(yíng)優(yōu)勢(shì)-實(shí)惠價(jià)格-不悔選擇
 詢價(jià)
更多TZ0340A供應(yīng)商 更新時(shí)間2025-2-2 9:18:00

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