UGF15XT中文資料威世科技數(shù)據(jù)手冊PDF規(guī)格書

FEATURES

? Glass passivated chip junction

? Ultrafast recovery times

? Soft recovery charateristics

? Low switching losses, high efficiency

? High forward surge capability

? Meets MSL level 1, per J-STD-020, LF maximum

peak of 245 °C (for TO-263AB package)

? Solder dip 260 °C, 40 s (for TO-220AC and

ITO-220AC package)

? Component in accordance to RoHS 2002/95/EC

and WEEE 2002/96/EC

TYPICAL APPLICATIONS

For use in high voltage, high frequency power factor

correctors, switching mode power supplies,

freewheeling diodes and secondary dc-to-dc

rectification application.