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UJA1069

LIN fail-safe system basis chip

Generaldescription TheUJA1069fail-safeSystemBasisChip(SBC)replacesbasicdiscretecomponentswhicharecommonineveryElectronicControlUnit(ECU)withaLocalInterconnectNetwork(LIN)interface.Thefail-safeSBCsupportsallnetworkingapplicationswhichcontrolvariouspowerandse

nxpNXP Semiconductors

恩智浦恩智浦半導(dǎo)體公司

UJA1069

UJA1069

nxpNXP Semiconductors

恩智浦恩智浦半導(dǎo)體公司

PDF上傳者:深圳市明烽威電子有限公司

UJA1069

LIN fail-safe system basis chip

nxpNXP Semiconductors

恩智浦恩智浦半導(dǎo)體公司

UJA1069

LIN fail-safe system basis chip

PhilipsNXP Semiconductors

飛利浦荷蘭皇家飛利浦

UJA1069TW

LIN fail-safe system basis chip

Generaldescription TheUJA1069fail-safeSystemBasisChip(SBC)replacesbasicdiscretecomponentswhicharecommonineveryElectronicControlUnit(ECU)withaLocalInterconnectNetwork(LIN)interface.Thefail-safeSBCsupportsallnetworkingapplicationswhichcontrolvariouspowerandse

nxpNXP Semiconductors

恩智浦恩智浦半導(dǎo)體公司

UJA1069TW24

LIN fail-safe system basis chip

Generaldescription TheUJA1069fail-safeSystemBasisChip(SBC)replacesbasicdiscretecomponentswhicharecommonineveryElectronicControlUnit(ECU)withaLocalInterconnectNetwork(LIN)interface.Thefail-safeSBCsupportsallnetworkingapplicationswhichcontrolvariouspowerandse

nxpNXP Semiconductors

恩智浦恩智浦半導(dǎo)體公司

UJA1069_09

LIN fail-safe system basis chip

nxpNXP Semiconductors

恩智浦恩智浦半導(dǎo)體公司

UJA1069TW

LIN fail-safe system basis chip

nxpNXP Semiconductors

恩智浦恩智浦半導(dǎo)體公司

UJA1069TW

LIN fail-safe system basis chip

PhilipsNXP Semiconductors

飛利浦荷蘭皇家飛利浦

UJA1069TW24

LIN fail-safe system basis chip

PhilipsNXP Semiconductors

飛利浦荷蘭皇家飛利浦

UJA1069TW24

LIN fail-safe system basis chip

nxpNXP Semiconductors

恩智浦恩智浦半導(dǎo)體公司

UJA1069TW/5V0/C/T

包裝:卷帶(TR) 封裝/外殼:32-TSSOP(0.240",6.10mm 寬)裸露焊盤 類別:集成電路(IC) 專用 描述:IC INTFACE SPECIALIZED 32HTSSOP

NXP USA Inc.

NXP USA Inc.

NXP USA Inc.

UJA1069TW24/3V0,51

包裝:卷帶(TR) 封裝/外殼:24-TSSOP(0.173",4.40mm 寬)裸露焊盤 類別:集成電路(IC) 專用 描述:IC INTFACE SPECIALIZED 24HTSSOP

NXP USA Inc.

NXP USA Inc.

NXP USA Inc.

UJA1069TW24/3V0:51

包裝:卷帶(TR) 封裝/外殼:24-TSSOP(0.173",4.40mm 寬)裸露焊盤 類別:集成電路(IC) 專用 描述:IC INTFACE SPECIALIZED 24HTSSOP

NXP USA Inc.

NXP USA Inc.

NXP USA Inc.

詳細(xì)參數(shù)

  • 型號:

    UJA1069

  • 制造商:

    PHILIPS

  • 制造商全稱:

    NXP Semiconductors

  • 功能描述:

    LIN fail-safe system basis chip

供應(yīng)商型號品牌批號封裝庫存備注價格
NXP
TSSOP
3200
原裝長期供貨!
詢價
NXP
1701+
?
8600
只做原裝進(jìn)口,假一罰十
詢價
NXP
2020+
4500
百分百原裝正品 真實公司現(xiàn)貨庫存 本公司只做原裝 可
詢價
NXP
22+
HTSSOP24
5000
全新原裝現(xiàn)貨!價格優(yōu)惠!可長期
詢價
NXP
24+
HTSSOP24
2568
原裝優(yōu)勢!絕對公司現(xiàn)貨
詢價
NXP
22+23+
TSSOP
20270
絕對原裝正品全新進(jìn)口深圳現(xiàn)貨
詢價
NXP/恩智浦
24+
20000
原裝現(xiàn)貨
詢價
NXP
22+
SOP
9852
只做原裝正品現(xiàn)貨!或訂貨假一賠十!
詢價
NXP USA Inc.
21+
32-HTSSOP
35200
一級代理/放心采購
詢價
NXP/恩智浦
2020+
NA
80000
只做自己庫存,全新原裝進(jìn)口正品假一賠百,可開13%增
詢價
更多UJA1069供應(yīng)商 更新時間2024-12-23 16:13:00