UN0201M05V330P中文資料優(yōu)恩半導體數(shù)據(jù)手冊PDF規(guī)格書

Feature

SMD type zinc oxide based ceramic chip

Insulator over coat keeps excellent low and stable leakage

current

Plating termination provided good solderability characteristic

Quick response time (<1ns)

Low clamping voltage

High transient current capability

Meet IEC 61000-4-2, 61000-4-4, and 61000-4-5 standard

Compact size for EIA 0201/0402/0603/1206

Application

Suitable for Push-Button, Power Line and Low Frequency single line

over voltage protect.

Applications for Mother Board, Notebook, Cellular Phone, PDA,

handheld device, DSC, DV, Scanner, and Set-Top Box…etc.