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US-2012

包裝:袋 類別:原型開發(fā),制造品 適配器,分接板 描述:PROTO BOARD 12PIN THRU-HOLE SIP

Capital

Capital Advanced Technologies

VACL2012

Terminal,Compression

HUBBELL

HUBBELL INCORPORATED

VACL2012BN

Terminal,Compression

HUBBELL

HUBBELL INCORPORATED

VAUL2012

AluminumCompressionTerminalfor2/0AL/CU,2/06/1ACSR,3/0COMPACT

HUBBELL

HUBBELL INCORPORATED

VLS2012E

InductorsforPowerCircuitsWoundFerrite

OverviewoftheVLS-ESeries FEATURES Magneticshieldtypewoundinductorforpowercircuits. Low-profileproductlineupwithmax.heightsof0.8mm,0.95mm,1.0mm,1.2mm,and1.5mmallowingfordifferentusages. Highmagneticshieldconstructionandcompatiblewithhigh-densitymount

TDKTDK Corporation

TDK株式會社東電化(中國)投資有限公司

VLS2012E

InductorsforPowerCircuitsWoundFerrite

OverviewoftheVLS-ESeries FEATURES Magneticshieldtypewoundinductorforpowercircuits. Low-profileproductlineupwithmax.heightsof0.8mm,0.95mm,1.0mm,1.2mm,and1.5mmallowingfordifferentusages. Highmagneticshieldconstructionandcompatiblewithhigh-densitymount

TDKTDK Corporation

TDK株式會社東電化(中國)投資有限公司

VLS2012E

InductorsforPowerCircuitsWoundFerrite

OverviewoftheVLS-ESeries FEATURES Magneticshieldtypewoundinductorforpowercircuits. Low-profileproductlineupwithmax.heightsof0.8mm,0.95mm,1.0mm,1.2mm,and1.5mmallowingfordifferentusages. Highmagneticshieldconstructionandcompatiblewithhigh-densitymount

TDKTDK Corporation

TDK株式會社東電化(中國)投資有限公司

VLS2012E

InductorsforPowerCircuitsWoundFerrite

OverviewoftheVLS-ESeries FEATURES Magneticshieldtypewoundinductorforpowercircuits. Low-profileproductlineupwithmax.heightsof0.8mm,0.95mm,1.0mm,1.2mm,and1.5mmallowingfordifferentusages. Highmagneticshieldconstructionandcompatiblewithhigh-densitymount

TDKTDK Corporation

TDK株式會社東電化(中國)投資有限公司

VLS2012E

InductorsforPowerCircuitsWoundFerriteVLS-Eseries

OverviewoftheVLS-ESeries FEATURES Magneticshieldtypewoundinductorforpowercircuits. Low-profileproductlineupwithmax.heightsof0.8mm,0.95mm,1.0mm,1.2mm,and1.5mmallowingfordifferentusages. Highmagneticshieldconstructionandcompatiblewithhigh-densitymount

TDKTDK Corporation

TDK株式會社東電化(中國)投資有限公司

VLS2012E

InductorsforPowerCircuitsWoundFerrite

OverviewoftheVLS-ESeries FEATURES Magneticshieldtypewoundinductorforpowercircuits. Low-profileproductlineupwithmax.heightsof0.8mm,0.95mm,1.0mm,1.2mm,and1.5mmallowingfordifferentusages. Highmagneticshieldconstructionandcompatiblewithhigh-densitymount

TDKTDK Corporation

TDK株式會社東電化(中國)投資有限公司

產(chǎn)品屬性

  • 產(chǎn)品編號:

    US-2012

  • 制造商:

    Capital Advanced Technologies

  • 類別:

    原型開發(fā),制造品 > 適配器,分接板

  • 系列:

    2000, UNI-SIP?

  • 包裝:

  • 原型板類型:

    通孔轉(zhuǎn) SIP

  • 接受的封裝:

    非特定

  • 針位數(shù):

    12

  • 板厚度:

    0.031"(0.79mm)1/32"

  • 材料:

    FR4 環(huán)氧玻璃

  • 大小 / 尺寸:

    0.598" 長 x 1.201" 寬(15.20mm x 30.50mm)

  • 描述:

    PROTO BOARD 12PIN THRU-HOLE SIP

供應(yīng)商型號品牌批號封裝庫存備注價格
Capital Advanced Technologies
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65
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