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BCR5003CEGKWS

ThinFilm,Back-ContactResistor

FEATURES ?Wirebondable ?Onlyonewirebondrequired ?Smallsize:0.020inchessquare ?Resistancerange:10?to1M? ?Oxidizedsiliconsubstrateforgoodpower dissipation ?Moistureresistant ?Casesize:0202 ?Resistormaterial:tantalumnitride,self-passivating ?Materialcate

VishayVishay Siliconix

威世科技威世科技半導(dǎo)體

BCR5003CKAHWS

ThinFilm,Back-ContactResistor

FEATURES ?Wirebondable ?Onlyonewirebondrequired ?Smallsize:0.020inchessquare ?Resistancerange:10?to1M? ?Oxidizedsiliconsubstrateforgoodpower dissipation ?Moistureresistant ?Casesize:0202 ?Resistormaterial:tantalumnitride,self-passivating ?Materialcate

VishayVishay Siliconix

威世科技威世科技半導(dǎo)體

BCR5003CKAKWS

ThinFilm,Back-ContactResistor

FEATURES ?Wirebondable ?Onlyonewirebondrequired ?Smallsize:0.020inchessquare ?Resistancerange:10?to1M? ?Oxidizedsiliconsubstrateforgoodpower dissipation ?Moistureresistant ?Casesize:0202 ?Resistormaterial:tantalumnitride,self-passivating ?Materialcate

VishayVishay Siliconix

威世科技威世科技半導(dǎo)體

BCR5003CKGHWS

ThinFilm,Back-ContactResistor

FEATURES ?Wirebondable ?Onlyonewirebondrequired ?Smallsize:0.020inchessquare ?Resistancerange:10?to1M? ?Oxidizedsiliconsubstrateforgoodpower dissipation ?Moistureresistant ?Casesize:0202 ?Resistormaterial:tantalumnitride,self-passivating ?Materialcate

VishayVishay Siliconix

威世科技威世科技半導(dǎo)體

BCR5003CKGKWS

ThinFilm,Back-ContactResistor

FEATURES ?Wirebondable ?Onlyonewirebondrequired ?Smallsize:0.020inchessquare ?Resistancerange:10?to1M? ?Oxidizedsiliconsubstrateforgoodpower dissipation ?Moistureresistant ?Casesize:0202 ?Resistormaterial:tantalumnitride,self-passivating ?Materialcate

VishayVishay Siliconix

威世科技威世科技半導(dǎo)體

XF5003-CS

SOLDERABILITYLEADSSHALLMEETMILSTD202G

XFMRS

XFMRS，Inc.

XG-BGA-5003

Compressionplatedistributesforcesevenly

IRONWOOD

Ironwood Electronics.

XMS5003X

AC-DCPowerSupplies

TDKTDK Corporation

TDK株式會(huì)社東電化（中國(guó)）投資有限公司

YG5003B

Controlledavalancherectifiers

DESCRIPTION DO-214AC;SOD106surfacemountablepackagewithglasspassivatedchip. Thewell-definedvoid-freecaseisofatransfer-mouldedthermo-settingplastic. FEATURES ?Glasspassivated ?Highmaximumoperatingtemperature ?Lowleakagecurrent ?Excellentstability ?Guaranteedaval

PhilipsNXP Semiconductors

飛利浦荷蘭皇家飛利浦

詳細(xì)參數(shù)

  • 型號(hào)：

    UT5003Z

  • 制造商：

    UTC-IC

  • 制造商全稱：

    UTC-IC

  • 功能描述：

    DUAL ENHANCEMENT MODE(N-CHANNEL/P-CHANNEL)

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