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VERSAKIT-30XX中文資料RAMTRON數(shù)據(jù)手冊(cè)PDF規(guī)格書(shū)

VERSAKIT-30XX
廠商型號(hào)

VERSAKIT-30XX

功能描述

VersaKit-30xx Development System Overview

文件大小

8.13308 Mbytes

頁(yè)面數(shù)量

28 頁(yè)

生產(chǎn)廠商 Ramtron International Corporation
企業(yè)簡(jiǎn)稱(chēng)

RAMTRON

中文名稱(chēng)

Ramtron International Corporation官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二

更新時(shí)間

2025-1-11 20:22:00

VERSAKIT-30XX規(guī)格書(shū)詳情

? VRS51L3074 in QFP-64 package soldered onboard (contact Ramtron for details on the VRS51L3174 in QFP-44 package and the VRS51L2070)

? FM31xx MCU companion, FM25xx SPI FRAM and FM24xx I2C FRAM devices installed

? 5x2 header to connect VJTAG-USB programming/debugging interface

? 2 DB9 serial port female connectors and 1 onboard RS-232 transceiver with configuration jumper

? Tact switches for manual reset and external interrupt of the processor

? Four sets of 16 probing points around VRS51L3074 device

? 22x2 header alongside prototyping area to access QFP-44 device pins (header pin number corresponds to device pin number)

? 32x2 header alongside prototyping area to access QFP-64 device pins (header pin number corresponds to the device pin number)

? Prototyping space

? Character LCD interface header footprint

? External crystal footprint

? 8 uncommitted user LEDs

? Onboard 3.3V regulator with power-on LED

? Optional regulator footprint

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LELON ELECTRONICS CORPORATION
2023+
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16000
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LELON
23+
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3927
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LELON
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796
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90000
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GALAXY
23+
BGA
880000
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Intel
24+
QFP
35200
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LELON
11+
2500
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LEL
1535+
16000
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ST
23+
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16900
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ST
22+
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16900
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