首頁>VJ0805A1R1GXYTW1BC>規(guī)格書詳情
VJ0805A1R1GXYTW1BC中文資料威世科技數(shù)據(jù)手冊PDF規(guī)格書
相關(guān)芯片規(guī)格書
更多- VJ0805A1R0CXSP
- VJ0805A1R0BXYC
- VJ0805A1R0CXYP
- VJ0805A1R0CXYC
- VJ0805A1R0BXYP
- VJ0805A1R0CXSC
- VJ0805A1R0BXSP
- VJ0805A1R0BXSC
- VJ0805A1R1FXQCW1BC
- VJ0805A1R1FXQPW1BC
- VJ0805A1R1FXQTW1BC
- VJ0805A1R1FXSCW1BC
- VJ0805A1R1FXSPW1BC
- VJ0805A1R1FXSTW1BC
- VJ0805A1R1FXYCW1BC
- VJ0805A1R1FXYPW1BC
- VJ0805A1R1FXYTW1BC
- VJ0805A1R1GXQCW1BC
VJ0805A1R1GXYTW1BC規(guī)格書詳情
FEATURES
? Available from 0402 to 1210 body sizes
? Ultra stable C0G (NP0) dielectric
? High capacitance in X5R, X7R
? Ni-barrier with 100 % tin terminations
? Dry sheet technology process
? Base Metal Electrode system (BME)
? Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
? Consumer electronics
? Telecommunications
? Data processing
? Mobile applications
