VLMS30..中文資料威世科技數(shù)據(jù)手冊PDF規(guī)格書

DESCRIPTION

These new devices have been designed to meet the

increasing demand for AllnGaP based low current SMD

LEDs.

The package of the VLM.30.. is the PLCC-2 package.

It consists of a lead frame which is embedded in a white

thermoplast. The reflector inside this package is filled up

with clear epoxy.

FEATURES

? SMD LED with exceptional brightness

? Compatible with automatic placement

equipment

? EIA and ICE standard package

? Compatible with IR reflow, vapor phase and

wave solder processes according to

CECC 00802 and J-STD-020

? Available in 8 mm tape

? Low profile package

? Non-diffused lens: excellent for coupling to light

pipes and backlighting

? Very low power consumption

? Luminous intensity ratio in one packaging unit

IVmax./IVmin. ≤ 1.6

? ESD withstand voltage: up to 2 kV according to

JESD22-A114-B

? Preconditioning according to JEDEC? level 2a

? AEC-Q101 qualified

? Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912