W25M02GW集成電路（IC）的存儲器規(guī)格書PDF中文資料

GENERAL DESCRIPTIONS

The W25M02GW (2 x 1G-bit) Serial MCP (Multi Chip Package) Flash memory is based on the W25N Serial SLC NAND SpiFlash? series by stacking two individual W25N01GW die into a standard 8-pin package. It offers the highest memory density for the low pin-count package, as well as Concurrent Operations in Serial Flash memory for the first time. The W25M SpiStack? series is ideal for small form factor system designs, and applications that demand high Program/Erase data throughput. All W25N SpiFlash family devices are offered in space-saving packages which were impossible to use in the past for the typical NAND flash memory.

FEATURES

? New Family of SpiFlash Memories

– W25M02GW: 2x1G-bit / 2x128M-Byte

– Standard SPI: CLK, /CS, DI, DO, /WP, /HOLD

– Dual SPI: CLK, /CS, IO0, IO1, /WP, /HOLD

– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3

– Compatible SPI serial flash commands

? Highest Performance Serial NAND Flash

– 104MHz Standard/Dual/Quad SPI clocks

– 208/416MHz equivalent Dual/Quad SPI

– 40MB/S continuous data transfer rate

– Fast Program/Erase performance

– More than 100,000 erase/program cycles

– More than 10-year data retention

? Efficient “Continuous Read Mode”(1)

– Alternative method to the Buffer Read Mode

– No need to issue “Page Data Read” between

Read commands

– Allows direct read access to the entire array

? Flexible “Concurrent Operations”

– Independent single die access

– Allows “Read while Program/Erase”

– Allows “Multi Die Program/Erase”

– Improves Program/Erase throughput

? Low Power, Wide Temperature Range

– Single 1.70 to 1.95V supply

– 25mA active, 20μA standby current

– -40°C to +85°C operating range

? Flexible Architecture with 128KB blocks

– Uniform 128K-Byte Block Erase

– Flexible page data load methods

? Advanced Features

– On chip 1-Bit ECC for memory array

– ECC status bits indicate ECC results

– bad block management and LUT(2) access

– Software and Hardware Write-Protect

– Power Supply Lock-Down and OTP protection

– 2KB Unique ID and 2KB parameter pages

– Ten 2KB OTP pages(3)

? Space Efficient Packaging

– 8-pad WSON 8x6-mm

– 24-ball TFBGA 8x6-mm

– Contact Winbond for other package options