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W25M02GWZEIG集成電路(IC)的存儲(chǔ)器規(guī)格書(shū)PDF中文資料

W25M02GWZEIG
廠商型號(hào)

W25M02GWZEIG

參數(shù)屬性

W25M02GWZEIG 封裝/外殼為8-WDFN 裸露焊盤(pán);包裝為托盤(pán);類(lèi)別為集成電路(IC)的存儲(chǔ)器;產(chǎn)品描述:IC FLASH 2GBIT SPI/QUAD 8WSON

功能描述

1.8V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH

絲印標(biāo)識(shí)

25M02GWZEIG

封裝外殼

ZE / 8-WDFN 裸露焊盤(pán)

文件大小

2.31791 Mbytes

頁(yè)面數(shù)量

68 頁(yè)

生產(chǎn)廠商 Winbond
企業(yè)簡(jiǎn)稱(chēng)

WINBOND華邦電子

中文名稱(chēng)

華邦電子股份有限公司官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

更新時(shí)間

2025-2-11 19:27:00

W25M02GWZEIG規(guī)格書(shū)詳情

GENERAL DESCRIPTIONS

The W25M02GW (2 x 1G-bit) Serial MCP (Multi Chip Package) Flash memory is based on the W25N Serial SLC NAND SpiFlash? series by stacking two individual W25N01GW die into a standard 8-pin package. It offers the highest memory density for the low pin-count package, as well as Concurrent Operations in Serial Flash memory for the first time. The W25M SpiStack? series is ideal for small form factor system designs, and applications that demand high Program/Erase data throughput. All W25N SpiFlash family devices are offered in space-saving packages which were impossible to use in the past for the typical NAND flash memory.

FEATURES

? New Family of SpiFlash Memories

– W25M02GW: 2x1G-bit / 2x128M-Byte

– Standard SPI: CLK, /CS, DI, DO, /WP, /HOLD

– Dual SPI: CLK, /CS, IO0, IO1, /WP, /HOLD

– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3

– Compatible SPI serial flash commands

? Highest Performance Serial NAND Flash

– 104MHz Standard/Dual/Quad SPI clocks

– 208/416MHz equivalent Dual/Quad SPI

– 40MB/S continuous data transfer rate

– Fast Program/Erase performance

– More than 100,000 erase/program cycles

– More than 10-year data retention

? Efficient “Continuous Read Mode”(1)

– Alternative method to the Buffer Read Mode

– No need to issue “Page Data Read” between

Read commands

– Allows direct read access to the entire array

? Flexible “Concurrent Operations”

– Independent single die access

– Allows “Read while Program/Erase”

– Allows “Multi Die Program/Erase”

– Improves Program/Erase throughput

? Low Power, Wide Temperature Range

– Single 1.70 to 1.95V supply

– 25mA active, 20μA standby current

– -40°C to +85°C operating range

? Flexible Architecture with 128KB blocks

– Uniform 128K-Byte Block Erase

– Flexible page data load methods

? Advanced Features

– On chip 1-Bit ECC for memory array

– ECC status bits indicate ECC results

– bad block management and LUT(2) access

– Software and Hardware Write-Protect

– Power Supply Lock-Down and OTP protection

– 2KB Unique ID and 2KB parameter pages

– Ten 2KB OTP pages(3)

? Space Efficient Packaging

– 8-pad WSON 8x6-mm

– 24-ball TFBGA 8x6-mm

– Contact Winbond for other package options

產(chǎn)品屬性

  • 產(chǎn)品編號(hào):

    W25M02GWZEIG

  • 制造商:

    Winbond Electronics

  • 類(lèi)別:

    集成電路(IC) > 存儲(chǔ)器

  • 系列:

    SpiFlash?

  • 包裝:

    托盤(pán)

  • 存儲(chǔ)器類(lèi)型:

    非易失

  • 存儲(chǔ)器格式:

    閃存

  • 技術(shù):

    FLASH - NAND(SLC)

  • 存儲(chǔ)容量:

    2Gb(256M x 8)

  • 存儲(chǔ)器接口:

    SPI - 四 I/O

  • 寫(xiě)周期時(shí)間 - 字,頁(yè):

    700μs

  • 電壓 - 供電:

    1.7V ~ 1.95V

  • 工作溫度:

    -40°C ~ 85°C(TA)

  • 安裝類(lèi)型:

    表面貼裝型

  • 封裝/外殼:

    8-WDFN 裸露焊盤(pán)

  • 供應(yīng)商器件封裝:

    8-WSON(8x6)

  • 描述:

    IC FLASH 2GBIT SPI/QUAD 8WSON

供應(yīng)商 型號(hào) 品牌 批號(hào) 封裝 庫(kù)存 備注 價(jià)格
22+
8600
全新正品現(xiàn)貨 有掛就有現(xiàn)貨
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winbond(華邦)
23+
NA
20094
正納10年以上分銷(xiāo)經(jīng)驗(yàn)原裝進(jìn)口正品做服務(wù)做口碑有支持
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Winbond Electronics
23+/24+
8-WDFN
8600
只供原裝進(jìn)口公司現(xiàn)貨+可訂貨
詢(xún)價(jià)
WINBOND/華邦
21+
WSON-88x6mm
880000
明嘉萊只做原裝正品現(xiàn)貨
詢(xún)價(jià)
Winbond
24+
8-WDFN
12720
專(zhuān)注Winbond品牌原裝正品代理分銷(xiāo),認(rèn)準(zhǔn)水星電子
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WINBOND
24+
DIP
21
詢(xún)價(jià)
華邦
22+
NA
500000
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WINBOND/華邦
22+
WSON-88x6mm
8900
英瑞芯只做原裝正品!!!
詢(xún)價(jià)
Winbond
2022+
原廠原包裝
8600
全新原裝 支持表配單 中國(guó)著名電子元器件獨(dú)立分銷(xiāo)
詢(xún)價(jià)
Winbond Electronics
24+
8-WDFN 裸露焊盤(pán)
9350
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