WLCSP-V01中文資料amkor數(shù)據(jù)手冊PDF規(guī)格書
WLCSP-V01規(guī)格書詳情
WAFER LEVEL FEATURES
4-196 ball count
Small body 0.16 mm2 to large 100.0 mm2 body size
Polyimide (PI), PBO, low-cure polymers and Redistribution Layer (RDL) available
Electroplated Sn/Ag <0.3 mm and SAC alloy ball-loaded bumping options ≥0.25 mm pitch
Reliable thick Cu UBM or Ni/Au for best in class EM performance
Compatible with conventional SMT assembly and test techniques
Applications
The WLCSP package family is applicable for a wide range of semi conductor device types from high end RF WLAN combo chips, to FPGAs, power management, Flash/EEPROM, integrated passive networks and standard analog. WLCSP offers the lowest total cost of ownership enabling higher semiconductor content while leveraging the smallest form factor and one of the highest performing, most reliable, semiconductor package platforms on the market today.
WLCSP is ideally suited for, but not limited to, mobile phones, tablets, netbook PCs, disk drives, digital still & video cameras, navigation devices, game controllers, other portable/remote products and some automotive end applications.
