WLCSP-V01中文資料amkor數(shù)據(jù)手冊PDF規(guī)格書
| 廠商型號 |
WLCSP-V01 |
| 功能描述 | Wafer Level Processing & Die Processing Services (WLP/DPS) |
| 文件大小 |
813.75 Kbytes |
| 頁面數(shù)量 |
3 頁 |
| 生產(chǎn)廠商 | Amkor Technology |
| 企業(yè)簡稱 |
amkor |
| 中文名稱 | Amkor Technology官網(wǎng) |
| 原廠標(biāo)識 |  |
| 數(shù)據(jù)手冊 | |
| 更新時間 | 2025-2-26 15:51:00 |
| 人工找貨 | WLCSP-V01價格和庫存，歡迎聯(lián)系客服免費(fèi)人工找貨 |
WLCSP-V01規(guī)格書詳情
WAFER LEVEL FEATURES
4-196 ball count
Small body 0.16 mm2 to large 100.0 mm2 body size
Polyimide (PI), PBO, low-cure polymers and Redistribution Layer (RDL) available
Electroplated Sn/Ag <0.3 mm and SAC alloy ball-loaded bumping options ≥0.25 mm pitch
Reliable thick Cu UBM or Ni/Au for best in class EM performance
Compatible with conventional SMT assembly and test techniques
Applications
The WLCSP package family is applicable for a wide range of semi conductor device types from high end RF WLAN combo chips, to FPGAs, power management, Flash/EEPROM, integrated passive networks and standard analog. WLCSP offers the lowest total cost of ownership enabling higher semiconductor content while leveraging the smallest form factor and one of the highest performing, most reliable, semiconductor package platforms on the market today.
WLCSP is ideally suited for, but not limited to, mobile phones, tablets, netbook PCs, disk drives, digital still & video cameras, navigation devices, game controllers, other portable/remote products and some automotive end applications.
