首頁(yè) >WS512K32BV-XXXE>規(guī)格書列表
零件編號(hào) | 下載&訂購(gòu) | 功能描述 | 制造商&上傳企業(yè) | LOGO |
---|---|---|---|---|
WS512K32BV-XXXE | 512Kx32 3.3V SRAM MODULE FEATURES ■AccessTimesof15*,17,20ns ■LowVoltageOperation ■Packaging ?66-pin,PGAType,1.385inchsquareHermeticCeramicHIP(Package402) ?68lead,HermeticCQFP(G2),22mm(0.880inch)square(Package500).DesignedtofitJEDEC68lead0.990CQFJfootprint ■Organizeda | WEDC White Electronic Designs Corporation | WEDC | |
ACT-F512K32HighSpeed16MegabitFLASHMultichipModule | AEROFLEX Aeroflex Circuit Technology | AEROFLEX | ||
ACT-S512K32VHighSpeed3.3Volt16MegabitSRAMMultichipModule GeneralDescription TheACT–S512K32VisaHighSpeed4megabitCMOSSRAMMultichipModule(MCM)designedforfulltemperaturerange,3.3VPowerSupply,military,space,orhighreliabilitymassmemoryandfastcacheapplications. Features ■4LowPowerCMOS512Kx8SRAMsinoneMCM ■Overall | AEROFLEX Aeroflex Circuit Technology | AEROFLEX | ||
ACT-SF512K32HighSpeed512Kx32SRAM/512Kx32FlashMultichipModule FEATURES ■4–512Kx8SRAMs&4–512Kx8FlashDieinOneMCM ■AccessTimesof25ns,35ns(SRAM)and60ns,70ns,90ns(Flash) ■Organizedas512Kx32ofSRAMand512Kx32ofFlashMemorywithCommonDataBus ■LowPowerCMOS ■InputandOutputTTLCompatibleDesign ■MIL-PRF-38534 | AEROFLEX Aeroflex Circuit Technology | AEROFLEX | ||
16-MbRADIATION-HARDENEDSRAM | TITexas Instruments 德州儀器美國(guó)德州儀器公司 | TI | ||
16-MbRADIATION-HARDENEDSRAM | TI1Texas Instruments(TI) 德州儀器德州儀器 (TI) | TI1 | ||
16-MbRADIATION-HARDENEDSRAM | TI1Texas Instruments(TI) 德州儀器德州儀器 (TI) | TI1 | ||
16-MbRADIATION-HARDENEDSRAM | TITexas Instruments 德州儀器美國(guó)德州儀器公司 | TI | ||
16-MbRADIATION-HARDENEDSRAM | TITexas Instruments 德州儀器美國(guó)德州儀器公司 | TI | ||
16-MbRADIATION-HARDENEDSRAM | TI1Texas Instruments(TI) 德州儀器德州儀器 (TI) | TI1 | ||
16-MbRADIATION-HARDENEDSRAM | TITexas Instruments 德州儀器美國(guó)德州儀器公司 | TI | ||
512Kx32SRAM3.3VMULTI-CHIPPACKAGE | WEDC White Electronic Designs Corporation | WEDC | ||
512Kx32SRAMMULTI-CHIPPACKAGE FEATURES ■AccessTimesof12,15,17,20,ns ■Packaging ?16mmx18mm,143PBGA ■Organizedas512Kx32,UserConfigurableas1Mx16or2Mx8 ■Commercial,IndustrialandMilitaryTemperatureRanges ■TTLCompatibleInputsandOutputs ■5VPowerSupply ■LowPowerCMOS | WEDC White Electronic Designs Corporation | WEDC | ||
512Kx325VFLASHMODULE,SMD5962-94612 | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | ETC1 | ||
512KX32SRAMMODULESMD5962-94611 [WhiteElectronic] 512Kx32SRAMMODULE,SMD5962-94611 | ETCList of Unclassifed Manufacturers 未分類制造商 | ETC | ||
512Kx32SRAM3.3VMODULE [WhiteElectronicDesignsCorporation] FEATURES ■AccessTimesof15,17,20ns ■LowVoltageOperation ■Packaging ?66-pin,PGAType,1.075inchsquare,HermeticCeramicHIP(Package400) ?68lead,22.4mm(0.88)CQFP,4.6mm(0.180)high,(Package509) ?68lead,23.9mm(0.940sq.)L | ETC1List of Unclassifed Manufacturers etc未分類制造商未分類制造商 | ETC1 | ||
512Kx32SRAM3.3VMULTICHIPPACKAGE FEATURES ■AccessTimesof15,17,20ns ■LowVoltageOperation ■Packaging ?66-pin,PGAType,1.075inchsquare,HermeticCeramicHIP(Package400) ?68lead,22.4mm(0.880inch)CQFP,(G2U),3.56mm(0.140),(Package510) ■Organizedas512Kx32;UserConfigurableas2x512Kx16or4x5 | WEDC White Electronic Designs Corporation | WEDC | ||
512Kx32SRAMMODULE,SMD5962-94611 FEATURES ■AccessTimesof70,85,100,120ns ■Packaging ?68lead,HermeticCQFP(G2T)1,22.4mm(0.880inch)square.4.57mm(0.180inch)high(Package509) ■Organizedas512Kx32,UserConfigurableas1Mx16or2Mx8 ■Commercial,IndustrialandMilitaryTemperatureRanges ■TTLCompati | WEDC White Electronic Designs Corporation | WEDC | ||
512KX32SRAM/FLASHMODULE FEATURES AccessTimesof25ns(SRAM)and70,90ns(FLASH) Packaging ?66pin,PGAType,1.385squareHIP,HermeticCeramicHIP(Package402) ?68lead,HermeticCQFP(G2T),22.4mm(0.880)square(Package509)4.57mm(0.180)height.DesignedtofitJEDEC68lead0.990CQFJfo | WEDC White Electronic Designs Corporation | WEDC |
詳細(xì)參數(shù)
- 型號(hào):
WS512K32BV-XXXE
- 制造商:
WEDC
- 制造商全稱:
White Electronic Designs Corporation
- 功能描述:
512Kx32 3.3V SRAM MODULE
供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
---|---|---|---|---|---|---|---|
WEDC |
18 |
PGA |
200 |
進(jìn)口原裝正品優(yōu)勢(shì)供應(yīng)QQ3171516190 |
詢價(jià) | ||
WEDC |
2020+ |
PGA |
8000 |
只做自己庫(kù)存,全新原裝進(jìn)口正品假一賠百,可開(kāi)13%增 |
詢價(jià) | ||
ADI |
LFCSP |
6850 |
萊克訊每片來(lái)自原廠原盒原包裝假一罰十價(jià)優(yōu) |
詢價(jià) | |||
WEDC |
22+ |
PGA |
12245 |
現(xiàn)貨,原廠原裝假一罰十! |
詢價(jià) | ||
WEDC |
PGA |
396379 |
集團(tuán)化配單-有更多數(shù)量-免費(fèi)送樣-原包裝正品現(xiàn)貨-正規(guī) |
詢價(jià) | |||
WSI |
2318+ |
PGA |
4862 |
只做進(jìn)口原裝!假一賠百!自己庫(kù)存價(jià)優(yōu)! |
詢價(jià) | ||
WHITE |
2021+ |
PGA |
1600 |
自家?guī)齑?百分之百原裝 |
詢價(jià) | ||
ST/意法 |
23+ |
QFN |
3000 |
一級(jí)代理原廠VIP渠道,專注軍工、汽車、醫(yī)療、工業(yè)、 |
詢價(jià) | ||
WEDC |
21+ |
20000 |
原裝現(xiàn)貨 只做自己公司真實(shí)庫(kù)存 |
詢價(jià) | |||
WEDC |
21+ |
PGA |
645 |
航宇科工半導(dǎo)體-央企合格優(yōu)秀供方! |
詢價(jià) |
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