X2FBGA中文資料amkor數(shù)據(jù)手冊(cè)PDF規(guī)格書

FEATURES

Cutting-edge technology and expanding package offerings provide a platform from prototype-toproduction

Copper (Cu) wire interconnect method and high-volume infrastructure at all Amkor CABGA production facilities

Lowest cost using Amkor standard CABGA bill of materials selection

1.5-27 mm body size available

Square or rectangle packages available

4-700 ball/lead counts

0.4, 0.5, 0.65, 0.75, 0.80 & 1.0 mm ball pitch available

JEDEC publication 95 design guide 4.5 (JEP95)

RoHS-6 (green) BOM options for 100% of CABGA family

Thermal conductivity epoxy (8 W/mk) and thermal conductivity compound (3 W/mK) are available

Applications

The ChipArray? package family is applicable for a wide range of semiconductors from high end FPGAs, ASICS to memory, analog, RF devices, MCUs and simple PLDs requiring a package size smaller than conv entional PBGAs or leadframe packages. ChipArray? packages fill the need for the low cost, minimum space, high performance and reliability requirements of mobile and gaming devices, notebooks, personal computers, networking, automotive and industrial applications.