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XAM62D24AVGHIANF中文資料德州儀器數據手冊PDF規(guī)格書
XAM62D24AVGHIANF規(guī)格書詳情
1 Features
Processor Cores:
? Up to Quad Arm? Cortex?-A53 microprocessor
subsystem at up to 1.4GHz
– Quad-core Cortex-A53 cluster with 512KB L2
shared cache with SECDED ECC
– Each A53 core has 32KB L1 DCache with
SECDED ECC and 32KB L1 ICache with Parity
protection
? Single-core Arm? Cortex?-R5F at up to 800MHz,
integrated as part of MCU Channel with FFI
– 32KB ICache, 32KB L1 DCache, and 64KB
TCM with SECDED ECC on all memories
– 512KB SRAM with SECDED ECC
? Single-core Arm? Cortex?-R5F at up to 800MHz,
integrated to support Device Management
– 32KB ICache, 32KB L1 DCache, and 64KB
TCM with SECDED ECC on all memories
? DSP with Matrix Multiplication Accelerator based
on single-core C7x
– C7x floating point, up to 40GFLOPS, 256-bit
Vector DSP at 1.0GHz
– Matrix Multiply Accelerator (MMA), up to
2TOPS (8b) at 1.0GHz
– 32KB L1 DCache with SECDED ECC and
64KB L1 ICache with Parity protection
– 1.25MB of L2 SRAM with SECDED ECC
Memory Subsystem:
? Up to 2.29MB of On-chip RAM
– 64KB of On-Chip RAM (OCRAM) with
SECDED ECC, can be divided into smaller
banks in increments of 32KB for as many as
2 separate memory banks
– 256KB of On-Chip RAM with SECDED ECC in
SMS Subsystem
– 176KB of On-Chip RAM with SECDED ECC in
SMS Subsystem for TI security firmware
– 512KB of On-chip RAM with SECDED ECC in
Cortex-R5F MCU Subsystem
– 64KB of On-chip RAM with SECDED ECC in
Device/Power Manager Subsystem
– 1.25MB of L2 SRAM with SECDED ECC in C7x
DSP with Matrix Multiplication Accelerator
? DDR Subsystem (DDRSS)
– Supports LPDDR4
– 32-bit data bus with inline ECC
– Supports speeds up to 3733MT/s
– Max addressable range of 8GBytes
Functional Safety:
? Functional Safety-Compliant targeted [Automotive]
– Developed for functional safety applications
– Documentation will be available to aid
functional safety system design
– Systematic capability up to ASIL D targeted
– Hardware integrity up to ASIL B targeted
? AEC - Q100 qualified [Automotive]
Security:
? Secure boot supported
– Hardware-enforced Root-of-Trust (RoT)
– Support to switch RoT via backup key
– Support for takeover protection, IP protection,
and anti-roll back protection
? Trusted Execution Environment (TEE) supported
– Arm TrustZone? based TEE
– Extensive firewall support for isolation
– Secure watchdog/timer/IPC
– Secure storage support
– Replay Protected Memory Block (RPMB)
support
? Dedicated Security Controller with user
programmable HSM core and dedicated security
DMA & IPC subsystem for isolated processing
? Cryptographic acceleration supported
– Session-aware cryptographic engine with ability
to auto-switch key-material based on incoming
data stream
? Supports cryptographic cores
– AES – 128-/192-/256-Bit key sizes
– SHA2 – 224-/256-/384-/512-Bit key sizes
– DRBG with true random number generator
– PKA (Public Key Accelerator) to Assist in
RSA/ECC processing for secure boot
? Debugging security
– Secure software controlled debug access
– Security aware debugging
High-Speed Interfaces:
? Integrated Ethernet switch supporting (total 2
external ports)
– RMII(10/100) or RGMII (10/100/1000)
– IEEE1588 (Annex D, Annex E, Annex F with
802.1AS PTP)
– Clause 45 MDIO PHY management
– Packet Classifier based on ALE engine with
512 classifiers
– Priority based flow control
– Time Sensitive Networking (TSN) support
– Four CPU H/W interrupt Pacing
– IP/UDP/TCP checksum offload in hardware
? Two USB2.0 Ports
– Port configurable as USB host, USB peripheral,
or USB Dual-Role Device (DRD mode)
– Integrated USB VBUS detection
? One Camera Serial interface (CSI-2) Receiver with
4-Lane D-PHY
– High Speed External Processor Data Receive
Interface over CSI-2 and MIPI D-PHY
General Connectivity:
? 9x Universal Asynchronous Receiver-Transmitters
(UART)
? 5x Serial Peripheral Interface (SPI) controllers
? 6x Inter-Integrated Circuit (I2C) ports
? 3x Multichannel Audio Serial Ports (McASP)
– Transmit and Receive Clocks up to 50MHz
– Up to 4/6/16 Serial Data Pins across 3x McASP
with Independent TX and RX Clocks
– Supports Time Division Multiplexing (TDM),
Inter-IC Sound (I2S), and Similar Formats
– Supports Digital Audio Interface Transmission
(SPDIF, IEC60958-1, and AES-3 Formats)
– FIFO Buffers for Transmit and Receive
(256 Bytes)
– Support for audio reference output clock
? 3x enhanced PWM modules (ePWM)
? 3x enhanced Quadrature Encoder Pulse modules
(eQEP)
? 3x enhanced Capture modules (eCAP)
? General-Purpose I/O (GPIO), All LVCMOS I/O can
be configured as GPIO
? 3x Controller Area Network (CAN) modules with
CAN-FD support
– Conforms w/ CAN Protocol 2.0 A, B and
ISO 11898-1
– Full CAN-FD support (up to 64-data bytes)
– Parity/ECC check for Message RAM
– Speed up to 8Mbps
Media and Data Storage:
? 3x Multi-Media Card/Secure Digital? (MMC/SD?/
SDIO) interface
– 1x 8-bit eMMC interface up to HS200 speed
– 2x 4-bit SD/SDIO interface up to UHS-I
– Compliant with eMMC 5.1, SD 3.0, and SDIO
Version 3.0
? 1× General-Purpose Memory Controller (GPMC)
up to 133MHz
– Flexible 8- and 16-bit Asynchronous Memory
Interface with up to four Chip (22-bit address)
Selects (NAND, NOR, Muxed-NOR, and
SRAM)
– Uses BCH code to support 4-, 8-, or 16-bit ECC
– Uses Hamming code to support 1-bit ECC
– Error Locator Module (ELM)
? Used with the GPMC to locate addresses
of data errors from syndrome polynomials
generated using a BCH algorithm
? Supports 4-, 8-, and 16-bit per 512-
Byte block error location based on BCH
algorithms
? OSPI/QSPI with DDR / SDR support
– Support for Serial NAND and Serial NOR Flash
devices
– 4GBytes memory address support
– XIP mode with optional on-the-fly encryption
Power Management:
? Low-power modes supported by Device/Power
Manager
– Partial IO support for CAN/GPIO/UART wakeup
Boot Options:
? UART
? I2C EEPROM
? OSPI/QSPI Flash
? GPMC NOR/NAND Flash
? Serial NAND Flash
? SD Card
? eMMC
? USB (host) Mass Storage device
? USB (slave) boot from external host (DFU mode)
? Ethernet
Technology / Package:
? 16-nm FinFET technology
? 18mm x 18mm, 0.8mm pitch full-array, 484-pin
FCCSP (ANF)
2 Applications
? Automotive / Premium audio amplifier
? Industrial / Professional audio
? Aerospace & defense / Radar and Radio
? Marine equipment / Sonar
? Medical & healthcare / Ultrasound scanner
? Test & measurement / Instrumentation
3 Description
The AM62D processor from the Sitara? MPU family is targeted for applications needing high-performance
Digital Signal Processing. Some of these applications include:
? Audio: Automotive premium amplifier and professional audio
? Radar and Radio: Aerospace and Defense
? Sonar: Marine equipments
? Ultrasound: Medical equipments
? Instrumentation: Current, Voltage, other signals: Test and Measurement
Key cores on the device include the Arm? Cortex?-A53 and C7000? (“C7x”) scalar and vector DSP core from
Texas Instruments, a dedicated Matrix Multiplication Accelerator (MMA), along with an isolated MCU island. All
protected by industrial and automotive grade safety and security hardware accelerators.
DSP Core Overview: the C7504 core from C7x family provides up to 40GFLOPS of DSP compute. It achieves
4x to 8x or more performance compared to the previous generation C66x DSP core. Some of the key features
includes:
? 256-bit fixed- and floating-point DSP vector core
? Single-cycle latency to access L2 memory via Streaming Engine
? Improved control code efficiency
? True 64-bit machine with 64-bit memory addressing and single-cycle 64-bit base arithmetic operations
Integration Overview: along with C7x DSP core, the AM62D SoC integrates up to Quad Arm? Cortex?-A53
providing additional 16.8KDMIPS compute and HLOS flexibility of Linux or Real-Time Operating System (RTOS).
Up to two Arm? Cortex?-R5F subsystems enable low-level, timing critical processing tasks to leave the Arm?
Cortex?-A53 and DSP core’s unencumbered for applications. Integrated diagnostics and safety features support
operations up to SIL-2 and ASIL-B levels while the integrated security features protect data against modern day
attacks. The AM62D device also offers a 3-port Gigabit Ethernet switch with Time-Sensitive Networking (TSN) to
enable audio networking features such as, Ethernet Audio Video Bridging (eAVB) and Dante, while peripherals
like the McASP, enable multi-channel I2S and TDM Audio inputs and outputs.
供應商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
---|---|---|---|---|---|---|---|
JST |
20+ |
na |
65790 |
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詢價 | ||
TI |
22+ |
FCBGA (ALV) |
6000 |
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詢價 | ||
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1844+ |
NA |
9852 |
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TI |
23+ |
HTQFP64 |
3000 |
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詢價 | ||
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2220+ |
N |
6401 |
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22+23+ |
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8000 |
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JST/日壓 |
2420+ |
/ |
533069 |
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TAITIEN |
24+ |
N |
9000 |
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JST |
新 |
57 |
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TI/ |
24+ |
HTQFP64 |
5000 |
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詢價 |