XCC2745P1E0WRHARQ1中文資料德州儀器數(shù)據(jù)手冊PDF規(guī)格書

1 Features

Wireless MCU Processing Elements

? Arm? Cortex?-M33 processor (96MHz) with FPU

(floating point unit), TrustZone?-M support and

CDE (custom datapath extension) for machine

learning acceleration

? Algorithm Processing Unit (APU) (96MHz)

– Mathematical accelerator for efficient vector

and matrix operations

– Bluetooth? 6.0 Channel Sounding postprocessing

support for IFFT and advanced

super-resolution algorithms like MUSIC

(MUltiple SIgnal Classification)

Wireless MCU Memory

? Up to 1MB of in-system programmable flash

? Up to 162KB of SRAM

? 32KB of System ROM with secure boot root of

trust (RoT) and a serial (SPI/UART) bootloader

? Serial wire debug (SWD)

Qualified for automotive application

? AEC-Q100 Grade 2 qualified:

– Device temperature: –40°C to +125°C junction

temperature

? HBM ESD Classification Level 2

? CDM ESD Classification Level C3

MCU Peripherals

? 23 GPIOs, digital peripherals can be routed to

multiple GPIOs

– Two IO pads SWD, multiplexed with GPIOs

– Two IO pads LFXT, multiplexed with GPIOs

– 19 DIOs (analog or digital IOs)

? All GPIOs with wakeup and interrupt capabilities

? 3 × 16-bit and 1 × 32-bit general-purpose timers,

quadrature decode mode support

? Real-time clock (RTC)

? Watchdog timer

? System timer for radio, RTOS, and application

operations for Bluetooth channel sounding

postprocessing

? 12-bit ADC, up to 1.2Msps, 8 external inputs

? Temperature sensor and battery monitor

? 1× low power comparator

? 2× UART with LIN capability

? 2× SPI

? 1× I2C

? 1× I2S

? 1× CAN-FD controller

Security enablers

? ISO21434 Automotive Cybersecurity Compliant

? Hardware Security Module (HSM) with proprietary

controller and dedicated memories supporting

accelerated cryptographic operations and secure

key storage:

– AES (up to 256 bits) crypto accelerator

– ECC (up to 521 bits), RSA (up to 3072 bits)

public key accelerator

– SHA-2 (up to 512 bits) accelerator

– True random number generator

– HSM firmware update support

? Separate AES 128bit crypto accelerator (LAES) for

latency-critical link-layer crypto operations

? Secure boot and secure firmware updates

? Cortex?-M33 TrustZone-M, MPU, memory

firewalls for software isolation

? Voltage glitch monitor (VGM)

Low power consumption (at 3.3V)

? On-chip buck DC/DC converter

? RX current: 6.1mA

? TX current at 0dBm: 7.7mA

? TX current at +10dBm: 24mA

? TX current at +20dBm: 128mA (P version)

? Active mode MCU 96MHz (CoreMark?): 6.8mA

? Standby: 0.9μA (low power mode, RTC on, full

RAM retention)

? Reset or Shutdown: 160nA

Wireless protocol support High-performance radio

? 2.4GHz RF transceiver compatible with Bluetooth?

Low Energy specification

? Output power up to +10dBm (R version)

? Output power up to +20dBm (P version)

? Integrated BALUN

? Integrated RF switch

? Receiver sensitivity:

– -103.5dBm for Bluetooth? LE 125kbps

– -97dBm for Bluetooth? LE 1Mbps

Regulatory compliance

? Designed for systems targeting compliance with

worldwide radio frequency regulations

– EN 300 328 (Europe)

– FCC CFR47 Part 15 (US)

– ARIB STD-T66 (Japan)

Development Tools and Software

? LP-EM-CC2745R10-Q1 LaunchPad?

Development Kit

? BP-EM-CS Multiple antenna board for Bluetooth

6.0 Channel Sounding

? SimpleLink? Low Power F3 Software

Development Kit (SDK)

– Fully qualified Bluetooth? software protocol

stack in SDK

? Up to 32 concurrent multirole connections

? Bluetooth 6.0 Channel Sounding Support

? CCC Digital Key 3 / ICCE Bluetooth APIs

support for secure car access systems

? SysConfig system configuration tool

? SmartRF? Studio for simple radio configuration

Operating range:

? Junction temperature TJ: –40?C to 125?C

? Wide supply voltage range 1.71V to 3.8V

Package

? 6mm × 6mm QFN40 with wettable flanks

? RoHS-compliant package

2 Applications

? Automotive

– Car access and security systems

? Digital key

? Phone as a key (PaaK)

? Passive entry passive start (PEPS)

? Remote keyless entry (RKE)

3 Description

The SimpleLink? CC274xR-Q1 and CC274xP-Q1 devices are AEC-Q100 complaint wireless microcontrollers

(MCUs) supporting Bluetooth? Low Energy 6.0 for automotive applications. These devices are optimized for

low-power wireless communication in applications such as car access including passive entry passive start

(PEPS), phone as a key (PaaK), and remote keyless entry (RKE). The key features of this device include:

? Support for Bluetooth? 6.0 and earlier version features:

– LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple

advertisement Sets, CSA#2, as well as backward compatibility with earlier Low Energy specifications.

– Bluetooth? Channel Sounding technology and Algorithm Processing Unit (APU) to enable high accuracy,

low cost, and secure phase-based ranging mechanism for distance estimation.

? APU enables latency and power-efficient execution of distance-ranging signal processing algorithms

including FFT and super-resolution complex algorithms like MUSIC (MUltiple SIgnal Classification) at

the lowest energy consumption.

? Arm (Custom Data Extension) CDE instruction support for machine learning acceleration

? Fully qualified Bluetooth software protocol stack included with the SimpleLink? Low Power F3 Software

Development Kit (SDK)

? Advanced security features for connected wireless MCUs:

– Isolated HSM environment with a dedicated controller handling accelerated cryptographic and random

number generation operations

– Secure boot and firmware updates with the root of trust enabled by immutable system ROM

– ARM Cortex M33 TrustZone-M based trusted execution environment support

– Secure key storage support with HSM and TrustZone-M

– Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage

glitch injection.

– Dedicated AES-128 HW accelerator for handling timing critical link layer encryption/decryption operations

? Ultra-low standby current with full 162KB SRAM retention and RTC operation that enables significant battery

life extension, especially for applications with longer sleep intervals.

? Extended temperature support with the lowest standby current

? Integrated BALUN and integrated RF switch to support both transmit and receive operations on the same RF

pin even for the P version; thereby, enabling reduced a bill-of-material (BOM) board layout

? Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy

The CC274xR/P-Q1 devices are part of the SimpleLink? MCU platform, which consists of Wi-Fi?, Bluetooth Low

Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development

environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the

SimpleLink? platform enables you to add any combination of the portfolio’s devices into your design, allowing

100 percent code reuse when your design requirements change. For more information, visit SimpleLink? MCU

platform.