首頁>XCC2745P1E0WRHARQ1>規(guī)格書詳情
XCC2745P1E0WRHARQ1中文資料德州儀器數(shù)據(jù)手冊PDF規(guī)格書
相關(guān)芯片規(guī)格書
更多XCC2745P1E0WRHARQ1規(guī)格書詳情
1 Features
Wireless MCU Processing Elements
? Arm? Cortex?-M33 processor (96MHz) with FPU
(floating point unit), TrustZone?-M support and
CDE (custom datapath extension) for machine
learning acceleration
? Algorithm Processing Unit (APU) (96MHz)
– Mathematical accelerator for efficient vector
and matrix operations
– Bluetooth? Channel Sounding post-processing
support for IFFT and advanced superresolution
algorithms such as MUltiple SIgnal
Classification (MUSIC)
Wireless MCU Memory
? Up to 1MB of in-system programmable flash
? Up to 162KB of SRAM
? 32KB of System ROM with secure boot root of
trust (RoT) and a serial (SPI/UART) bootloader
? Serial wire debug (SWD)
Qualified for automotive application
? AEC-Q100 Grade 2 qualified:
– –40°C to +125°C junction temperature
? HBM ESD Classification Level 2
? CDM ESD Classification Level C3
MCU Peripherals
? 23 GPIOs, digital peripherals can be routed to
multiple GPIOs:
– Two SWD IO pads, multiplexed with GPIOs
– Two LFXT IO pads, multiplexed with GPIOs
– 19 DIOs (analog or digital IOs)
? All GPIOs with wakeup and interrupt capabilities
? 3 × 16-bit and 1 × 32-bit general-purpose timers,
quadrature decode mode support
? Real-time clock (RTC)
? Watchdog timer
? System timer for radio, RTOS, and application
operations for Bluetooth? channel sounding
postprocessing
? 12-bit ADC, up to 1.2MSPS, eight external inputs
? Temperature sensor and battery monitor
? 1× low power comparator
? 2× UART with LIN capability
? 2× SPI
? 1× I2C
? 1× I2S
? 1× CAN-FD controller with CAN/CAN-FD ISO
16845-1:2016 certification compliance
Security enablers
? ISO21434 Automotive Cybersecurity Compliant
? Hardware Security Module (HSM) with proprietary
controller and dedicated memories supporting
accelerated cryptographic operations and secure
key storage:
– AES (up to 256 bits) crypto accelerator
– ECC (up to 521 bits), RSA (up to 3072 bits)
public key accelerator
– SHA-2 (up to 512 bits) accelerator
– True random number generator
– HSM firmware update support
– DPA (Differential Power Analysis)
countermeasures for AES and ECC
? Separate AES 128-bit cryptographic accelerator
(LAES) for latency-critical link-layer operations
? Secure boot and secure firmware updates
? Cortex?-M33 TrustZone-M, MPU, memory
firewalls for software isolation
? Voltage glitch monitor (VGM)
Low power consumption (VDDS at 3.3V)
? On-chip buck DC/DC converter
? RX current: 6.1mA
? TX current at 0dBm: 7.7mA
? TX current at +10dBm: 24.5mA
? Active mode MCU 96MHz (CoreMark?): 6.8mA
? Standby: 0.9μA (low power mode, RTC on, full
SRAM retention)
? Shutdown: 160nA
Wireless protocol support
? Bluetooth? Low Energy 5.4
? Bluetooth? Low Energy 6.0 Ready
– Support for Bluetooth? Channel Sounding (High
Accuracy Distance Measurement)
High-performance radio
? 2.4GHz RF transceiver compatible with Bluetooth?
Low Energy specification
? Output power up to +10dBm (R version)
? Output power up to +20dBm (P version)
? Integrated BALUN
? Integrated RF switch
? Receiver sensitivity:
– Bluetooth? LE 125kbps: –103.5dBm
– Bluetooth? LE 1Mbps: –97dBm
Regulatory compliance
? Designed for systems targeting compliance with
worldwide radio frequency regulations
– EN 300 328 (Europe)
– FCC CFR47 Part 15 (US)
– ARIB STD-T66 (Japan)
Development Tools and Software
? LP-EM-CC2745R10-Q1 LaunchPad?
Development Kit
? BP-EM-CS Multiple antenna board for Bluetooth?
Channel Sounding
? SimpleLink? Low Power F3 Software
Development Kit (SDK)
– Fully qualified Bluetooth? software protocol
stack in SDK
? Up to 32 concurrent multirole connections
? Bluetooth? Low Energy 5.4 Support
? CCC Digital Key 3 / ICCE Bluetooth? APIs
support for secure car access systems
? Automotive SPICE (ASPICE) compliance for SDK
components including the Bluetooth? LE stack
? SysConfig system configuration tool
? SmartRF? Studio for simple radio configuration
Operating range:
? Junction temperature TJ: –40°C to 125°C
? Wide supply voltage range 1.71V to 3.8V
Package
? 6mm × 6mm QFN40 with wettable flanks
? RoHS-compliant package
2 Applications
? Automotive
– Car access and security systems
? Digital key
? Phone as a key (PaaK)
? Passive entry passive start (PEPS)
? Remote keyless entry (RKE)
3 Description
The SimpleLink? CC274xR-Q1 and CC274xP-Q1 devices are AEC-Q100 complaint wireless microcontrollers
(MCUs) supporting Bluetooth? Low Energy 5.4 for automotive applications. These devices are optimized for
low-power wireless communication in applications such as car access including passive entry passive start
(PEPS), phone as a key (PaaK), and remote keyless entry (RKE). The key features of this device include:
? Support for features in Bluetooth? 5.4 and earlier versions:
– LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple
advertisement sets, CSA#2, as well as backward compatibility with earlier Bluetooth? Low Energy
specifications
? Bluetooth? Channel Sounding technology support and Algorithm Processing Unit (APU) to enable high
accuracy, low cost, and secure phase-based ranging mechanism for distance estimation.
– APU enables latency and power-efficient execution of distance-ranging signal processing algorithms
including FFT and super-resolution complex algorithms like MUltiple SIgnal Classification (MUSIC)
? Arm?Custom Data Extension (CDE) instruction support for machine learning acceleration
? Fully qualified Bluetooth? software protocol stack included with the SimpleLink? Low Power F3 Software
Development Kit (SDK)
? Advanced security features for connected wireless MCUs:
– Isolated HSM environment with a dedicated controller handling accelerated cryptographic and random
number generation operations
– Secure boot and firmware updates with the root of trust enabled by immutable system ROM
– Arm? Cortex M33 TrustZone-M based trusted execution environment support
– Secure key storage support with HSM and TrustZone-M
– Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage
glitch injection
– Dedicated AES-128 HW accelerator for handling timing critical link layer encryption/decryption operations
? Ultra-low standby current with full 162KB SRAM retention and RTC operation that enables significant battery
life extension, especially for applications with longer sleep intervals
? Extended temperature support with the lowest standby current
? Integrated BALUN and integrated RF switch to support both transmit and receive operations on the same RF
pin even in the P version; thereby, enabling a reduced bill-of-material (BOM) board layout
? Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth? Low Energy
The CC274xR/P-Q1 devices are part of the SimpleLink? MCU platform, which consists of Wi-Fi?, Bluetooth?
Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use
development environment with a single core software development kit (SDK) and a rich toolset. A one-time
integration of the SimpleLink? platform enables you to add any combination of the portfolio’s devices into your
design, allowing 100 percent code reuse when your design requirements change. For more information, visit
SimpleLink? MCU platform.
供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
---|---|---|---|---|---|---|---|
TI/德州儀器 |
23+ |
NA/ |
3497 |
原裝現(xiàn)貨,當(dāng)天可交貨,原型號開票 |
詢價 | ||
xilinx |
22+ |
TO10 |
6800 |
詢價 | |||
TI |
13+ |
QFN |
450 |
原裝 |
詢價 | ||
TI/德州儀器 |
1414+ |
SOIC |
85 |
原裝現(xiàn)貨 |
詢價 | ||
TI/德州儀器 |
22+ |
SOIC |
6000 |
進口原裝 假一罰十 現(xiàn)貨 |
詢價 | ||
TI |
21+ |
QFN |
10000 |
原裝現(xiàn)貨假一罰十 |
詢價 | ||
XC |
2018+ |
TO10 |
6528 |
科恒偉業(yè)!承若只做進口原裝正品假一賠十!1581728776 |
詢價 | ||
TI/德州儀器 |
23+ |
QFN |
6500 |
只做原裝正品假一賠十為客戶做到零風(fēng)險!! |
詢價 | ||
TI/德州儀器 |
1414+ |
SOIC |
880000 |
明嘉萊只做原裝正品現(xiàn)貨 |
詢價 | ||
原廠 |
N/A |
90000 |
集團化配單-有更多數(shù)量-免費送樣-原包裝正品現(xiàn)貨-正規(guī) |
詢價 |