訂購數(shù)量 | 價格 |
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1+ |
首頁>XCKU3P-2FFVB676I>芯片詳情
XCKU3P-2FFVB676I 集成電路(IC)FPGA(現(xiàn)場可編程門陣列) XILINX/賽靈思
- 詳細(xì)信息
- 規(guī)格書下載
產(chǎn)品參考屬性
- 類型
描述
- 產(chǎn)品編號:
XCKU3P-2FFVB676I
- 制造商:
AMD Xilinx
- 類別:
- 系列:
Kintex? UltraScale+?
- 包裝:
托盤
- 電壓 - 供電:
0.825V ~ 0.876V
- 安裝類型:
表面貼裝型
- 工作溫度:
-40°C ~ 100°C(TJ)
- 封裝/外殼:
676-BBGA,F(xiàn)CBGA
- 供應(yīng)商器件封裝:
676-FCBGA(27x27)
- 描述:
IC FPGA 280 I/O 676FCBGA
供應(yīng)商
- 企業(yè):
深圳市勤思達(dá)科技有限公司
- 商鋪:
- 聯(lián)系人:
唐小姐
- 手機:
13662585201
- 詢價:
- 電話:
0755-83955172
- 傳真:
0755-83955172
- 地址:
深圳市福田區(qū)華強北賽格科技園4棟中12樓A4-2L
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