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XR0230P

ALL DIMENSIONS IN MM [INCH].

E-SWITCH

E-switch

ACDBQC0230R-HF

SMDSchottkyBarrierDiode

Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. -AEC-Q101Qualified.

COMCHIPComchip Technology

典琦典琦科技股份有限公司

ACDBUC0230-HF

SMDSchottkyBarrierDiode

COMCHIPComchip Technology

典琦典琦科技股份有限公司

ALN0230

InternallyMatchedLNAModule

ASB

Advanced Semiconductor Business Inc.

ALN0230

InternallyMatchedLNAModule

ASB

Advanced Semiconductor Business Inc.

AR0230

FullHDDigitalImageSensor

ONSEMION Semiconductor

安森美半導(dǎo)體安森美半導(dǎo)體公司

AR0230CS

1/2.7??nch2.1Mp/FullHDDigitalImageSensor

ONSEMION Semiconductor

安森美半導(dǎo)體安森美半導(dǎo)體公司

AR0230CS

1/2.7-Inch2.1Mp/FullHDDigitalImageSensor

ONSEMION Semiconductor

安森美半導(dǎo)體安森美半導(dǎo)體公司

ASB0230

SMDSchottkyBarrierDiode

Features IO=200mA VR=30V -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowdrop-downvoltage. -Majoritycarrierconduction -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated,sold

ANACHIPAnachip Corp

易亨電子易亨電子股份有限公司

B0230D

N-ChannelMOSFETusesadvancedtrenchtechnology

DOINGTERSHENZHEN DOINGTER SEMICONDUCTOR CO., LTD

杜因特深圳市杜因特半導(dǎo)體有限公司

CDBER0230L

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBER0230L-HF

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBER0230R

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBER0230R-HF

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBERT0230R

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0230

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0230-HF

SMDSchottkyBarrierDiode

Io=200mA RoHSDevice HalogenFree VR=30Volts Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. -Lowdrop-downvoltage. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplat

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0230L

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features LowforwardVoltage Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:SOD-323F(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMI

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0230L-HF

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Halogenfree. Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackagemoldedplastic. Terminals:Goldplated,sol

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0230R

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features LowforwardVoltage Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:SOD-323F(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMI

COMCHIPComchip Technology

典琦典琦科技股份有限公司

供應(yīng)商型號品牌批號封裝庫存備注價格
YAMAHA
20+
DIP32
35830
原裝優(yōu)勢主營型號-可開原型號增稅票
詢價
YAMAHA
2023+
DIP32
80000
一級代理/分銷渠道價格優(yōu)勢 十年芯程一路只做原裝正品
詢價
YAMAHA
24+
DIP32
35210
一級代理/放心采購
詢價
XRONET
2016+
PBFREE
5632
只做進(jìn)口原裝正品!現(xiàn)貨或者訂貨一周貨期!只要要網(wǎng)上有
詢價
XRONET
23+
QFN
20000
原廠原裝正品現(xiàn)貨
詢價
XRONET
20+
QFN
11520
特價全新原裝公司現(xiàn)貨
詢價
XRONET
1923+
QFN
7893
原裝進(jìn)口現(xiàn)貨庫存專業(yè)工廠研究所配單供貨
詢價
XRONET
23+
QFN
11200
原廠授權(quán)一級代理、全球訂貨優(yōu)勢渠道、可提供一站式BO
詢價
XRONET
24+
QFN
990000
明嘉萊只做原裝正品現(xiàn)貨
詢價
XRONET
2021+
QFN
100500
一級代理專營品牌!原裝正品,優(yōu)勢現(xiàn)貨,長期排單到貨
詢價
更多XR0230P供應(yīng)商 更新時間2025-1-12 14:13:00