首頁>ZL38090LDG1>規(guī)格書詳情

ZL38090LDG1中文資料美高森美數(shù)據(jù)手冊PDF規(guī)格書

ZL38090LDG1
廠商型號

ZL38090LDG1

參數(shù)屬性

ZL38090LDG1 封裝/外殼為64-VFQFN 裸露焊盤;包裝為卷帶(TR);類別為集成電路(IC) > 音頻專用;ZL38090LDG1應(yīng)用范圍:通信系統(tǒng);產(chǎn)品描述:IC AUDIO PROCESSOR 64QFN

功能描述

Designed for USB Headsets and Microphones

文件大小

2.48843 Mbytes

頁面數(shù)量

64

生產(chǎn)廠商 Microsemi Corporation
企業(yè)簡稱

Microsemi美高森美

中文名稱

美高森美公司官網(wǎng)

原廠標(biāo)識
數(shù)據(jù)手冊

下載地址一下載地址二到原廠下載

更新時(shí)間

2024-11-15 22:30:00

ZL38090LDG1規(guī)格書詳情

Description

The ZL38090 is part of Microsemi's Timberwolf audio

processor family of products that features Microsemi’s

innovative AcuEdge? firmware, which uses a set of

highly-complex and integrated algorithms designed for

audio enhancement. These algorithms are incorporated

into a powerful DSP platform that allows the user to

extract intelligible information from adverse audio

environments.

The Microsemi AcuEdge Firmware for the ZL38090

device is specifically designed for USB headset and USB

microphones. The ZLS38090 AcuEdge firmware is

royalty-free and provides an advanced audio feature set

including beam forming (BF), noise reduction (NR),

equalizers (EQ), and a compressor, limiter and expander

(CLE) to improve both the intelligibility and subjective

quality of voice in harsh acoustic environments.

Microsemi offers additional tools to speed up the product

development cycle. The MiTuner? ZLS38508 or

ZLS38508LITE GUI software packages allow a user to

interactively configure the ZL38090 device. The optional

ZLE38470BADA Automatic Tuning Kit provides

automatic tuning and easy control for manual fine tuning

adjustments.

Applications

? USB Beamforming Microphones

? USB to analog bridge/ USB to I2S bridge

? USB Headsets/headset dongles

? USB Speakerphones

? USB Speakers

產(chǎn)品屬性

  • 產(chǎn)品編號:

    ZL38090LDG1

  • 制造商:

    Microchip Technology

  • 類別:

    集成電路(IC) > 音頻專用

  • 包裝:

    卷帶(TR)

  • 功能:

    ??? ????

  • 應(yīng)用:

    通信系統(tǒng)

  • 接口:

    I2C,SPI

  • 安裝類型:

    表面貼裝型

  • 封裝/外殼:

    64-VFQFN 裸露焊盤

  • 供應(yīng)商器件封裝:

    64-QFN(9x9)

  • 描述:

    IC AUDIO PROCESSOR 64QFN

供應(yīng)商 型號 品牌 批號 封裝 庫存 備注 價(jià)格
MICROSE
2020+
QFN-64
80000
只做自己庫存,全新原裝進(jìn)口正品假一賠百,可開13%增
詢價(jià)
MICROCHIP(美國微芯)
23+
WLCSP56(3.05x3.05)
6000
誠信服務(wù),絕對原裝原盤
詢價(jià)
Microchip Technology
24+
64-VFQFN 裸露焊盤
25000
in stock音頻IC-原裝正品
詢價(jià)
MICROCHIP/微芯
23+
64-VFQFN
11200
原廠授權(quán)一級代理、全球訂貨優(yōu)勢渠道、可提供一站式BO
詢價(jià)
Microsemi Corporation
21+
64QFN
13880
公司只售原裝,支持實(shí)單
詢價(jià)
MICROCHIP/微芯
21+
56-UFBGA
880000
明嘉萊只做原裝正品現(xiàn)貨
詢價(jià)
MICROCHIP/微芯
23+
56-UFBGA
35200
只做原裝主打品牌QQ詢價(jià)有詢必回
詢價(jià)
MICROSEMI
589220
16余年資質(zhì) 絕對原盒原盤 更多數(shù)量
詢價(jià)
Microsemi Corporation
22+
64QFN
9000
原廠渠道,現(xiàn)貨配單
詢價(jià)
MICROCHIP/微芯
24+
56-UFBGA
7671
原裝正品.優(yōu)勢專營
詢價(jià)