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10SMB8.2CA中文資料順燁電子數(shù)據(jù)手冊PDF規(guī)格書
10SMB8.2CA規(guī)格書詳情
Features
For surface mounted applications in order to optimize board space
Low profile package
Built in strain relief
Glass p assivated j unction
Low inductance
Excellent clamping capability
1000W peak pulse power capability at 10/1000 μ s waveform,
r
epetition r ate (duty cycle): 0.01%
Fast response time
Typical I R less than 1 μ A above 12V
High Temperature soldering: 260℃/10 seconds at terminals
Plastic package has underwriters laboratory flammability 94V 0
Meets MSL level 1, per J STD 020
IEC61000 4 2 ESD 30KV Air, 30KV contact compliance
Applications
I/O interface
AC/DC power supply
Low frequency signal transmission line (RS232, RS485, etc.)
供應商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
---|---|---|---|---|---|---|---|
Me-TECH(美臺高科) |
23+ |
6000 |
誠信服務,絕對原裝原盤 |
詢價 | |||
UN SEMICONDUCTOR |
24+ |
con |
10000 |
查現(xiàn)貨到京北通宇商城 |
詢價 | ||
24+ |
N/A |
48000 |
一級代理-主營優(yōu)勢-實惠價格-不悔選擇 |
詢價 | |||
UN SEMICONDUCTOR |
24+ |
con |
2500 |
優(yōu)勢庫存,原裝正品 |
詢價 |