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A3P060集成電路(IC)的FPGA(現(xiàn)場(chǎng)可編程門陣列)規(guī)格書PDF中文資料

A3P060
廠商型號(hào)

A3P060

參數(shù)屬性

A3P060 封裝/外殼為132-WFQFN;包裝為托盤;類別為集成電路(IC)的FPGA(現(xiàn)場(chǎng)可編程門陣列);產(chǎn)品描述:IC FPGA 80 I/O 132QFN

功能描述

ProASIC3 Flash Family FPGAs with Optional Soft ARM Support
IC FPGA 80 I/O 132QFN

文件大小

10.66938 Mbytes

頁(yè)面數(shù)量

220 頁(yè)

生產(chǎn)廠商 Microsemi Corporation
企業(yè)簡(jiǎn)稱

Microsemi美高森美

中文名稱

美高森美公司官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

原廠下載下載地址一下載地址二到原廠下載

更新時(shí)間

2025-1-4 17:28:00

A3P060規(guī)格書詳情

A3P060屬于集成電路(IC)的FPGA(現(xiàn)場(chǎng)可編程門陣列)。由美高森美公司制造生產(chǎn)的A3P060FPGA(現(xiàn)場(chǎng)可編程門陣列)FPGA 是用于執(zhí)行邏輯運(yùn)算和信息處理的用戶可配置集成電路產(chǎn)品,通常具有非常高級(jí)別的集成功能。這些器件通常用于代替通用微處理器,其中已知運(yùn)算將以極高的速度執(zhí)行,例如用于接收和處理來(lái)自高速數(shù)據(jù)轉(zhuǎn)換器的信息。它們通常需要外部存儲(chǔ)設(shè)備來(lái)存儲(chǔ)用戶所需的配置,并在啟動(dòng)時(shí)重新加載這些配置。

Features and Benefits

High Capacity

? 15 k to 1 M System Gates

? Up to 144 kbits of True Dual-Port SRAM

? Up to 300 User I/Os

Reprogrammable Flash Technology

? 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process

? Instant On Level 0 Support

? Single-Chip Solution

? Retains Programmed Design when Powered Off

High Performance

? 350 MHz System Performance

? 3.3 V, 66 MHz 64-Bit PCI?

In-System Programming (ISP) and Security

? ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption (except ARM?-enabled ProASIC?3 devices) via JTAG (IEEE 1532–compliant)?

? FlashLock? to Secure FPGA Contents

Low Power

? Core Voltage for Low Power

? Support for 1.5 V-Only Systems

? Low-Impedance Flash Switches

High-Performance Routing Hierarchy

? Segmented, Hierarchical Routing and Clock Structure

Advanced I/O

? 700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)

? 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

? Wide Range Power Supply Voltage Support per JESD8-B, Allowing I/Os to Operate from 2.7 V to 3.6 V

? Bank-Selectable I/O Voltages—up to 4 Banks per Chip

? Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X? and LVCMOS 2.5 V / 5.0 V Input

? Differential I/O Standards: LVPECL, LVDS, B-LVDS, and M-LVDS (A3P250 and above)

? I/O Registers on Input, Output, and Enable Paths

? Hot-Swappable and Cold Sparing I/Os?

? Programmable Output Slew Rate? and Drive Strength

? Weak Pull-Up/-Down

? IEEE 1149.1 (JTAG) Boundary Scan Test

? Pin-Compatible Packages across the ProASIC3 Family

Clock Conditioning Circuit (CCC) and PLL?

? Six CCC Blocks, One with an Integrated PLL

? Configurable Phase-Shift, Multiply/Divide, Delay Capabilities and External Feedback

? Wide Input Frequency Range (1.5 MHz to 350 MHz)

Embedded Memory?

? 1 kbit of FlashROM User Nonvolatile Memory

? SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9, and ×18 organizations)?

? True Dual-Port SRAM (except ×18)

ARM Processor Support in ProASIC3 FPGAs

? M1 ProASIC3 Devices—ARM?Cortex?-M1 Soft Processor Available with or without Debug

產(chǎn)品屬性

更多
  • 產(chǎn)品編號(hào):

    A3P060-1QNG132

  • 制造商:

    Microsemi Corporation

  • 類別:

    集成電路(IC) > FPGA(現(xiàn)場(chǎng)可編程門陣列)

  • 系列:

    ProASIC3

  • 包裝:

    托盤

  • 電壓 - 供電:

    1.425V ~ 1.575V

  • 安裝類型:

    表面貼裝型

  • 工作溫度:

    0°C ~ 85°C(TJ)

  • 封裝/外殼:

    132-WFQFN

  • 供應(yīng)商器件封裝:

    132-QFN(8x8)

  • 描述:

    IC FPGA 80 I/O 132QFN

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