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CDBF0130L-HF

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Halogenfree. Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,so

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0130R

SMDSchottkyBarrierDiode

Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method2026. Mark

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0130R-HF

SMDSchottkyBarrierDiode

Io=100mA RoHSDevice HalogenFree VR=30Volts Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplat

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0130

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythinpackage. Lowstoredcharge. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Goldplated,solderable

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0130

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowstoredcharge. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Goldplated,solde

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0130-HF

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowstoredcharge. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Goldplated,solde

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0130L-HF

SMDSchottkyBarrierDiode

Io=100mA RoHSDevice HalogenFree VR=30Volts Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Gold

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0130R

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts RoHSDevice Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage moldedplastic. -Terminals:Goldplated,solder

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0130R-HF

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Gold

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBN0130

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:1206(3216)Standardpackage,moldedplastic Terminals:Solderplated,solderableperMIL-STD-750,method20

COMCHIPComchip Technology

典琦典琦科技股份有限公司

詳細參數(shù)

  • 型號：

    BA0130

  • 制造商：

    MITSUBISHI

  • 制造商全稱：

    Mitsubishi Electric Semiconductor

  • 功能描述：

    Triple Band(EGSM900/DCS1800/PCS1900) InGaP HBT Front-end module

供應商型號品牌批號封裝庫存備注價格
MITSUBISHI
2017+
SMD
1585
只做原裝正品假一賠十!
 詢價
MITSUBISHI
23+
NA
25060
只做進口原裝,終端工廠免費送樣
 詢價
QORVO
24+
SMD
5000
QORVO“芯達集團”專營品牌原裝正品假一罰十
 詢價
OK
ROHS
13352
一級代理 原裝正品假一罰十價格優(yōu)勢長期供貨
 詢價
ROHM
16+
SOT-23-5
12000
鍏ㄦ柊鍘熻鐜拌揣/浠鋒牸鍙皥!
 詢價
ROHM
20+
SOT-23-5
36800
原裝優(yōu)勢主營型號-可開原型號增稅票
 詢價
ROHM
24+
SOT-23-5
12000
原裝現(xiàn)貨假一賠十
 詢價
ROHM/羅姆
2019+PB
SOT-23-5
12000
全新-特價大量供貨房間
 詢價
ROHM
23+
SOT-23-5
7300
專注配單,只做原裝進口現(xiàn)貨
 詢價
ROHM
2025+
SOT-23-5
7695
全新原廠原裝產(chǎn)品、公司現(xiàn)貨銷售
 詢價
更多BA0130供應商 更新時間2025-4-26 12:02:00

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