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零件編號(hào)	下載&訂購(gòu)	功能描述	制造商&上傳企業(yè)	LOGO
CDBN0130	文件：56.01 Kbytes Page：2 Pages	SMD Schottky Barrier Diode Io=100mA VR=30Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:1206(3216)Standardpackage,moldedplastic Terminals:Solderplated,solderableperMIL-STD-750,method20	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBP0130L	文件：107.75 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode IO=100mA VR=30V RoHSDevice Features -Smallsurfacemountingtype. -Highreliability. MechanicalData -Case:MoldedplasticSOD-723 -Terminals:SolderableperMIL-STD-750,Method2026.1. -Polarity:Indicatedbycathodeband. -Mountingposition:Any.	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBP0130L	文件：107.75 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBP0130L-G	文件：51.88 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode ReverseVoltage:30Volts ForwardCurrent:100mA Features: ?SmallSurfaceMountingType ?HighReliability MechanicalData: ?Case:MoldedplasticSOD-723 ?Terminals:SolderableperMIL-STD-750,Method2026.1. ?Polarity:Indicatedbycathodeband. ?Mountingposition:Any. ?Marking:	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBP0130R	文件：68.76 Kbytes Page：2 Pages	SMDSchottkyBarrlierDiode IO=100mA VR=30V RoHSDevice Features -Smallsurfacemountingtype. -Lowreversecurrentandlowforwardvoltage. -Highreliability. MechanicalData -Case:MoldedplasticSOD-723 -Terminals:SolderableperMIL-STD-750,Method2026.1. -Polarity:Indicatedbycathodeband. -Mountin	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBP0130R-G	文件：52 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode ReverseVoltage:30Volts ForwardCurrent:100mA Features: ?SmallSurfaceMountingType ?LowReverseCurrentandLowForwardVoltage. ?HighReliability MechanicalData: ?Case:MoldedplasticSOD-723 ?Terminals:SolderableperMIL-STD-750,Method2026.1. ?Polarity:Indicatedbycath	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQC0130L-HF	文件：106.64 Kbytes Page：4 Pages	LowVFSMDSchottkyBarrierDiode	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQC0130R-HF	文件：469.34 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction.	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQR0130L	文件：200.44 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0402(1005)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQR0130L-HF	文件：201.65 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0402/SOD-923Fstandardpackage,moldedplastic. -Terminals:Goldplat	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQR0130R	文件：200.98 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Lowreversecurrent Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0402(1005)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-ST	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQR0130R-HF	文件：199.99 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0402/SOD-923Fstandardpackage,moldedplastic. -Terminals:Goldplat	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBS0130	文件：147.9 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBS0130	文件：61.59 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:0805(2012)Standardpackage,moldedplastic Terminals:Solderplated,solderableperMIL-STD-750,method202	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0130	文件：65.7 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0130-HF	文件：199.83 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -Lowstoredcharge. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderabl	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0130L	文件：201.72 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0130L-HF	文件：201.91 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Halogenfree. Mechanicaldata Case:0603(1608)standardpackage,moldedplastic. Terminals:Goldplated,so	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0130R	文件：202.23 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Lowreversecurrent. Mechanicaldata Case:0603(1608)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0130R-HF	文件：131.86 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode IO=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplate	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP

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供應(yīng)商	型號(hào)	品牌	批號(hào)	封裝	庫(kù)存	備注	價(jià)格
深圳市科恒偉業(yè)電子有限公司	CDBN0340	Comchip/典琦科技	1948+	SMD	6852	只做原裝正品現(xiàn)貨!或訂貨假一賠十!	詢(xún)價(jià)
深圳市鵬和科技有限公司	CDBN1030	COMCHIP	24+	SMD	5000	只做原裝公司現(xiàn)貨	詢(xún)價(jià)
深圳市威爾健半導(dǎo)體有限公司	CDBN1030	COMCHIP/典琦科技	23+	SMD	50000	全新原裝正品現(xiàn)貨,支持訂貨	詢(xún)價(jià)
深圳市英瑞爾電子科技有限公司	CDBN1030	COMCHIP	24+	SMD	2600	原裝現(xiàn)貨假一賠十	詢(xún)價(jià)
深圳市得捷芯城科技有限公司	CDBN1030	COMCHIP/典琦科技	23+	NA/	4650	原裝現(xiàn)貨,當(dāng)天可交貨,原型號(hào)開(kāi)票	詢(xún)價(jià)
深圳市宏捷佳電子科技有限公司	CDBP00340	Comchip Technology	24+	SOD-723	9350	獨(dú)立分銷(xiāo)商公司只做原裝誠(chéng)心經(jīng)營(yíng) 免費(fèi)試樣正品保證	詢(xún)價(jià)
深圳市一線(xiàn)半導(dǎo)體有限公司	CDBP00340-G	Comchip	24+	SOD-723	7500		詢(xún)價(jià)
深圳市科雨電子有限公司	CDBP00340-G	COMCHIP	1809+	SOD-723	16750	就找我吧!--邀您體驗(yàn)愉快問(wèn)購(gòu)元件!	詢(xún)價(jià)
深圳市易訊博科技有限公司	CDBP00340-G	Comchip	22+	NA	75	加我QQ或微信咨詢(xún)更多詳細(xì)信息,	詢(xún)價(jià)
現(xiàn)代芯城（深圳）科技有限公司	CDBP00340-G		24+	N/A	56000	一級(jí)代理-主營(yíng)優(yōu)勢(shì)-實(shí)惠價(jià)格-不悔選擇	詢(xún)價(jià)

更多CDBN0130供應(yīng)商更新時(shí)間2024-12-21 14:59:00

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