首頁 >CM1-04-GRAY>規(guī)格書列表
零件編號 | 下載&訂購 | 功能描述 | 制造商&上傳企業(yè) | LOGO |
---|---|---|---|---|
SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP,200THRU1000VOLTS | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTSILICONGENERALPURPOSERECTIFIERS | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1.0AMP,200THRU1000VOLTS | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP,200THRU1000VOLTS | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
GENERALPURPOSERECTIFIER1.0AMP,200THRU1,000VOLTS DESCRIPTION: TheCENTRALSEMICONDUCTOR1.0AmpSurfaceMountSiliconRectifierisahighquality,wellconstructed,highlyreliablecomponentdesignedforuseinalltypesofcommercial,industrial,entertainment,computer,andautomotiveapplications.Toorderdeviceson12mmTapeandReel(3000 | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
GENERALPURPOSERECTIFIER1.0AMP,200THRU1,000VOLTS DESCRIPTION: TheCENTRALSEMICONDUCTORCMR1-02Mseries1.0Ampsurfacemountsiliconrectifierisawellconstructed,highlyreliablecomponentdesignedforuseinalltypesofcommercial,industrial,entertainment,computer,andautomotiveapplicationswheresmallsizeisrequired.TheSMAcas | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTSILICONGENERALPURPOSERECTIFIERS | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTGENERALPURPOSESILICONRECTIFIER1AMP | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTGENERALPURPOSERECTIFIER GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
1AmpGlassPassivatedRectifierChip GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
1AmpGlassPassivatedRectifierChip GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
1AmpGlassPassivatedRectifierChip GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTHIGHVOLTAGERECTIFIER GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
SURFACEMOUNTHIGHVOLTAGERECTIFIER GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
1AmpGlassPassivatedRectifierChip GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/ | CentralCentral Semiconductor Corp 美國中央半導(dǎo)體 | Central | ||
FLYOVER?QSFPCABLEASSEMBLIES | Samtec Samtec, Inc | Samtec | ||
FLYOVER?QSFPCABLEASSEMBLIES | Samtec Samtec, Inc | Samtec | ||
(2.54mm).100 | Samtec Samtec, Inc | Samtec | ||
(2.54mm).100 | Samtec Samtec, Inc | Samtec |
詳細(xì)參數(shù)
- 型號:
CM1-04-GRAY
- 制造商:
Chicago Miniature Lighting LLC
- 制造商:
CML Innovative Technologies
供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
---|---|---|---|---|---|---|---|
原廠 |
23+ |
DIP |
5000 |
原裝正品,假一罰十 |
詢價 | ||
Hirose |
2020+ |
N/A |
1 |
加我qq或微信,了解更多詳細(xì)信息,體驗一站式購物 |
詢價 | ||
Hirose |
22+ |
NA |
1 |
加我QQ或微信咨詢更多詳細(xì)信息, |
詢價 | ||
NIPPON |
2022+ |
DIP |
87800 |
原廠代理 終端免費提供樣品 |
詢價 | ||
NIPPON |
23+ |
DIP |
6800 |
專注配單,只做原裝進(jìn)口現(xiàn)貨 |
詢價 | ||
NIPPON |
23+ |
DIP |
6800 |
專注配單,只做原裝進(jìn)口現(xiàn)貨 |
詢價 | ||
SHARLIGHT |
24+ |
DIP |
715 |
詢價 | |||
SHARLIGHT |
2023+ |
DIP |
80000 |
一級代理/分銷渠道價格優(yōu)勢 十年芯程一路只做原裝正品 |
詢價 | ||
SOP16 |
23+ |
121330 |
原廠授權(quán)一級代理,專業(yè)海外優(yōu)勢訂貨,價格優(yōu)勢、品種 |
詢價 | |||
CM |
SOP16TSSOP16 |
100000 |
3-5節(jié)電池保護(hù)IC |
詢價 |
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