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CPD64

Low Leakage Diode Low Leakage Diode Chip

PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize17.5x17.5MILS DieThickness8.0MILS AnodeBondingPadArea8.0MILSDIAMETER TopSideMetalizationAl-30,000? BackSideMetalizationAu-6,000?

CentralCentral Semiconductor Corp

美國中央半導(dǎo)體

CPD65

Low Leakage Diode Picoampere Diode Chip

PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize9.5X9.5MILS DieThickness7.5MILS AnodeBondingPadArea2.5MILSDIAMETER TopSideMetalizationAl-30,000? BackSideMetalizationAu-13,000?

CentralCentral Semiconductor Corp

美國中央半導(dǎo)體

CPD65-BAV45

The CPD65-BAV45 is a silicon 50mA, 35 Volt diode ideal for low leakage applications.

TheCPD65-BAV45isasilicon50mA,35Voltdiodeidealforlowleakageapplications. MECHANICALSPECIFICATIONS: DieSize11.8x11.8MILS DieThickness8.0MILS AnodeBondingPadSize2.35MILSDIAMETER TopSideMetalizationAl–15,000? BackSideMetalizationAu–18,000?

CentralCentral Semiconductor Corp

美國中央半導(dǎo)體

CPD66X

Low Leakage Diode Low Leakage Diode Chip

PROCESSDETAILS DieSize17.5x17.5MILS DieThickness5.9MILS AnodeBondingPadArea7.9MILSDIAMETER TopSideMetalizationAl-30,000? BackSideMetalizationAu-As-13,000?

CentralCentral Semiconductor Corp

美國中央半導(dǎo)體

CPD69

1 Amp Glass Passivated Rectifier Chip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國中央半導(dǎo)體

CPD71

Low Leakage Diode Low Leakage Switching Diode Chip

PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize11x11MILS DieThickness11MILS AnodeBondingPadArea3.3x3.3MILS TopSideMetalizationAl-15,000? BackSideMetalizationAu-18,000?

CentralCentral Semiconductor Corp

美國中央半導(dǎo)體

CPD73

Bridge Rectifier Monolithic Quad Diode Bridge Chip

PROCESSDETAILS DieSize25x25MILS DieThickness6.0MILS BondingPadArea1(+DC)3.0x3.0MILS BondingPadArea2(AC)3.0x7.0MILS BondingPadArea3(-DC)3.0x4.0MILS BondingPadArea4(AC)3.0x7.0MILS TopSideMetalizationAl-12,000? BackSideMe

CentralCentral Semiconductor Corp

美國中央半導(dǎo)體

CPD74

Switching Diode Monolithic Isolated Quad Switching Diode Chip

PROCESSDETAILS DieSize25x25MILS DieThickness6.0MILS Anode1,2,3,4BondingPadArea3.5x4.0MILS Cathode1,2,3,4BondingPadArea3.5x4.0MILS TopSideMetalizationAl-12,000? BackSideMetalizationAu-5,000?

CentralCentral Semiconductor Corp

美國中央半導(dǎo)體

CPD76V

Schottky Diode 1.0A Schottky Diode Chip

PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize32x32MILS DieThickness7.1MILS AnodeBondingPadArea26x26MILS TopSideMetalizationAl-20,000? BackSideMetalizationAu-12,000?

CentralCentral Semiconductor Corp

美國中央半導(dǎo)體

CPD76X

1 Amp Schottky Diode Chip

PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize32x32MILS DieThickness5.9MILS AnodeBondingPadArea27x27MILS TopSideMetalizationAl-20,000? BackSideMetalizationAu-12,000?

CentralCentral Semiconductor Corp

美國中央半導(dǎo)體

詳細(xì)參數(shù)

  • 型號(hào)：

    CPD

  • 制造商：

    ROHM

  • 制造商全稱：

    Rohm

  • 功能描述：

    Packaging specifications

供應(yīng)商型號(hào)品牌批號(hào)封裝庫存備注價(jià)格
INTERSIL
94+
SOP20
3600
全新原裝進(jìn)口自己庫存優(yōu)勢(shì)
 詢價(jià)
RCA
24+/25+
31
原裝正品現(xiàn)貨庫存價(jià)優(yōu)
 詢價(jià)
ACER
24+
TSSOP
3020
詢價(jià)
Comchip
2020+
WBFBP-0
20000
百分百原裝正品 真實(shí)公司現(xiàn)貨庫存 本公司只做原裝 可
 詢價(jià)
CP
2015+
SOP
19889
一級(jí)代理原裝現(xiàn)貨,特價(jià)熱賣!
 詢價(jià)
AVNET
13+
DIP-2
38488
原裝分銷
 詢價(jià)
Comchip
23+
SOT-363
7750
全新原裝優(yōu)勢(shì)
 詢價(jià)
COMCHP
2016+
SOD-523
3500
只做原裝,假一罰十,公司可開17%增值稅發(fā)票!
 詢價(jià)
ACER
24+
TSSOP
3500
原裝現(xiàn)貨,可開13%稅票
 詢價(jià)
原裝COMCHIP
24+
WBFBP-02C-C
5000
全現(xiàn)原裝公司現(xiàn)貨
 詢價(jià)
更多CPD供應(yīng)商 更新時(shí)間2025-4-7 9:31:00

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