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CY7C1320JV18-300BZC集成電路(IC)的存儲器規(guī)格書PDF中文資料

CY7C1320JV18-300BZC
廠商型號

CY7C1320JV18-300BZC

參數(shù)屬性

CY7C1320JV18-300BZC 封裝/外殼為165-LBGA;包裝為卷帶(TR);類別為集成電路(IC)的存儲器;產(chǎn)品描述:IC SRAM 18MBIT PARALLEL 165FBGA

功能描述

18-Mbit DDR-II SRAM 2-Word Burst Architecture

文件大小

616.03 Kbytes

頁面數(shù)量

26

生產(chǎn)廠商 CypressSemiconductor
企業(yè)簡稱

Cypress賽普拉斯

中文名稱

賽普拉斯半導(dǎo)體公司官網(wǎng)

原廠標(biāo)識
數(shù)據(jù)手冊

下載地址一下載地址二到原廠下載

更新時間

2025-1-4 17:48:00

CY7C1320JV18-300BZC規(guī)格書詳情

Functional Description

The CY7C1316JV18, CY7C1916JV18, CY7C1318JV18, and CY7C1320JV18 are 1.8V Synchronous Pipelined SRAMs equipped with DDR-II architecture. The DDR-II consists of an SRAM core with advanced synchronous peripheral circuitry and a one-bit burst counter.

Features

■ 18-Mbit density (2M x 8, 2M x 9, 1M x 18, 512K x 36)

■ 300 MHz clock for high bandwidth

■ 2-word burst for reducing address bus frequency

■ Double Data Rate (DDR) interfaces

(data transferred at 600 MHz) at 300 MHz

■ Two input clocks (K and K) for precise DDR timing

? SRAM uses rising edges only

■ Two input clocks for output data (C and C) to minimize clock

skew and flight time mismatches

■ Echo clocks (CQ and CQ) simplify data capture in high-speed

systems

■ Synchronous internally self-timed writes

■ DDR-II operates with 1.5 cycle read latency when the DLL is

enabled

■ Operates similar to a DDR-I device with 1 cycle read latency in

DLL off mode

■ 1.8V core power supply with HSTL inputs and outputs

■ Variable drive HSTL output buffers

■ Expanded HSTL output voltage (1.4V–VDD)

■ Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)

■ Offered in both Pb-free and non Pb-free packages

■ JTAG 1149.1 compatible test access port

■ Delay Lock Loop (DLL) for accurate data placement

產(chǎn)品屬性

  • 產(chǎn)品編號:

    CY7C1320JV18-300BZC

  • 制造商:

    Cypress Semiconductor Corp

  • 類別:

    集成電路(IC) > 存儲器

  • 包裝:

    卷帶(TR)

  • 存儲器類型:

    易失

  • 存儲器格式:

    SRAM

  • 技術(shù):

    SRAM - 同步,DDR II

  • 存儲容量:

    18Mb(512K x 36)

  • 存儲器接口:

    并聯(lián)

  • 電壓 - 供電:

    1.7V ~ 1.9V

  • 工作溫度:

    0°C ~ 70°C(TA)

  • 安裝類型:

    表面貼裝型

  • 封裝/外殼:

    165-LBGA

  • 供應(yīng)商器件封裝:

    165-FBGA(13x15)

  • 描述:

    IC SRAM 18MBIT PARALLEL 165FBGA

供應(yīng)商 型號 品牌 批號 封裝 庫存 備注 價格
CYPRESS
2016+
FBGA165
3526
假一罰十進(jìn)口原裝現(xiàn)貨原盤原標(biāo)!
詢價
Cypress
21+
FBGA165
13
原裝現(xiàn)貨假一賠十
詢價
CYPRESS
BGA
68900
原包原標(biāo)簽100%進(jìn)口原裝常備現(xiàn)貨!
詢價
Cypress
21+
165FBGA (13x15)
13880
公司只售原裝,支持實單
詢價
Cypress
165-FBGA
2800
Cypress一級分銷,原裝原盒原包裝!
詢價
Infineon Technologies
23+/24+
165-LBGA
8600
只供原裝進(jìn)口公司現(xiàn)貨+可訂貨
詢價
CYPRESS
22+
FBGA
10000
原裝正品優(yōu)勢現(xiàn)貨供應(yīng)
詢價
Cypress Semiconductor Corp
23+
165-FBGA13x15
7300
專注配單,只做原裝進(jìn)口現(xiàn)貨
詢價
Cypress Semiconductor Corp
23+
165-FBGA13x15
7300
專注配單,只做原裝進(jìn)口現(xiàn)貨
詢價
Cypress Semiconductor Corp
21+
48-TFBGA
5280
進(jìn)口原裝!長期供應(yīng)!絕對優(yōu)勢價格(誠信經(jīng)營
詢價