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CY7C1327G

4-Mbit (256K x 18) Pipelined Sync SRAM

Features ?Registeredinputsandoutputsforpipelinedoperation ?256K×18commonI/Oarchitecture ?3.3Vcorepowersupply ?3.3V/2.5VI/Ooperation ?Fastclock-to-outputtimes —2.6ns(for250-MHzdevice) —2.6ns(for225-MHzdevice) —2.8ns(for200-MHzdevice) —3.5

CypressCypressSemiconductor

賽普拉斯賽普拉斯半導(dǎo)體公司

CY7C1327G

4-Mbit (256K x 18) Pipelined Sync SRAM

CypressCypressSemiconductor

賽普拉斯賽普拉斯半導(dǎo)體公司

CY7C1327G-100AXC

4-Mbit (256K x 18) Pipelined Sync SRAM

Features ?Registeredinputsandoutputsforpipelinedoperation ?256K×18commonI/Oarchitecture ?3.3Vcorepowersupply ?3.3V/2.5VI/Ooperation ?Fastclock-to-outputtimes —2.6ns(for250-MHzdevice) —2.6ns(for225-MHzdevice) —2.8ns(for200-MHzdevice) —3.5

CypressCypressSemiconductor

賽普拉斯賽普拉斯半導(dǎo)體公司

CY7C1327G-100AXI

4-Mbit (256K x 18) Pipelined Sync SRAM

Features ?Registeredinputsandoutputsforpipelinedoperation ?256K×18commonI/Oarchitecture ?3.3Vcorepowersupply ?3.3V/2.5VI/Ooperation ?Fastclock-to-outputtimes —2.6ns(for250-MHzdevice) —2.6ns(for225-MHzdevice) —2.8ns(for200-MHzdevice) —3.5

CypressCypressSemiconductor

賽普拉斯賽普拉斯半導(dǎo)體公司

CY7C1327G-100BGC

4-Mbit (256K x 18) Pipelined Sync SRAM

Features ?Registeredinputsandoutputsforpipelinedoperation ?256K×18commonI/Oarchitecture ?3.3Vcorepowersupply ?3.3V/2.5VI/Ooperation ?Fastclock-to-outputtimes —2.6ns(for250-MHzdevice) —2.6ns(for225-MHzdevice) —2.8ns(for200-MHzdevice) —3.5

CypressCypressSemiconductor

賽普拉斯賽普拉斯半導(dǎo)體公司

CY7C1327G-100BGI

4-Mbit (256K x 18) Pipelined Sync SRAM

Features ?Registeredinputsandoutputsforpipelinedoperation ?256K×18commonI/Oarchitecture ?3.3Vcorepowersupply ?3.3V/2.5VI/Ooperation ?Fastclock-to-outputtimes —2.6ns(for250-MHzdevice) —2.6ns(for225-MHzdevice) —2.8ns(for200-MHzdevice) —3.5

CypressCypressSemiconductor

賽普拉斯賽普拉斯半導(dǎo)體公司

CY7C1327G-100BGXC

4-Mbit (256K x 18) Pipelined Sync SRAM

Features ?Registeredinputsandoutputsforpipelinedoperation ?256K×18commonI/Oarchitecture ?3.3Vcorepowersupply ?3.3V/2.5VI/Ooperation ?Fastclock-to-outputtimes —2.6ns(for250-MHzdevice) —2.6ns(for225-MHzdevice) —2.8ns(for200-MHzdevice) —3.5

CypressCypressSemiconductor

賽普拉斯賽普拉斯半導(dǎo)體公司

CY7C1327G-100BGXI

4-Mbit (256K x 18) Pipelined Sync SRAM

Features ?Registeredinputsandoutputsforpipelinedoperation ?256K×18commonI/Oarchitecture ?3.3Vcorepowersupply ?3.3V/2.5VI/Ooperation ?Fastclock-to-outputtimes —2.6ns(for250-MHzdevice) —2.6ns(for225-MHzdevice) —2.8ns(for200-MHzdevice) —3.5

CypressCypressSemiconductor

賽普拉斯賽普拉斯半導(dǎo)體公司

CY7C1327G-133AXC

4-Mbit (256K x 18) Pipelined Sync SRAM

Features ?Registeredinputsandoutputsforpipelinedoperation ?256K×18commonI/Oarchitecture ?3.3Vcorepowersupply ?3.3V/2.5VI/Ooperation ?Fastclock-to-outputtimes —2.6ns(for250-MHzdevice) —2.6ns(for225-MHzdevice) —2.8ns(for200-MHzdevice) —3.5

CypressCypressSemiconductor

賽普拉斯賽普拉斯半導(dǎo)體公司

CY7C1327G-133AXI

4-Mbit (256K x 18) Pipelined Sync SRAM

Features ?Registeredinputsandoutputsforpipelinedoperation ?256K×18commonI/Oarchitecture ?3.3Vcorepowersupply ?3.3V/2.5VI/Ooperation ?Fastclock-to-outputtimes —2.6ns(for250-MHzdevice) —2.6ns(for225-MHzdevice) —2.8ns(for200-MHzdevice) —3.5

CypressCypressSemiconductor

賽普拉斯賽普拉斯半導(dǎo)體公司

CY7C1327G-133BGC

4-Mbit (256K x 18) Pipelined Sync SRAM

Features ?Registeredinputsandoutputsforpipelinedoperation ?256K×18commonI/Oarchitecture ?3.3Vcorepowersupply ?3.3V/2.5VI/Ooperation ?Fastclock-to-outputtimes —2.6ns(for250-MHzdevice) —2.6ns(for225-MHzdevice) —2.8ns(for200-MHzdevice) —3.5

CypressCypressSemiconductor

賽普拉斯賽普拉斯半導(dǎo)體公司

CY7C1327G-133BGI

4-Mbit (256K x 18) Pipelined Sync SRAM

Features ?Registeredinputsandoutputsforpipelinedoperation ?256K×18commonI/Oarchitecture ?3.3Vcorepowersupply ?3.3V/2.5VI/Ooperation ?Fastclock-to-outputtimes —2.6ns(for250-MHzdevice) —2.6ns(for225-MHzdevice) —2.8ns(for200-MHzdevice) —3.5

CypressCypressSemiconductor

賽普拉斯賽普拉斯半導(dǎo)體公司

CY7C1327G-133BGXC

4-Mbit (256K x 18) Pipelined Sync SRAM

Features ?Registeredinputsandoutputsforpipelinedoperation ?256K×18commonI/Oarchitecture ?3.3Vcorepowersupply ?3.3V/2.5VI/Ooperation ?Fastclock-to-outputtimes —2.6ns(for250-MHzdevice) —2.6ns(for225-MHzdevice) —2.8ns(for200-MHzdevice) —3.5

CypressCypressSemiconductor

賽普拉斯賽普拉斯半導(dǎo)體公司

CY7C1327G-133BGXI

4-Mbit (256K x 18) Pipelined Sync SRAM

Features ?Registeredinputsandoutputsforpipelinedoperation ?256K×18commonI/Oarchitecture ?3.3Vcorepowersupply ?3.3V/2.5VI/Ooperation ?Fastclock-to-outputtimes —2.6ns(for250-MHzdevice) —2.6ns(for225-MHzdevice) —2.8ns(for200-MHzdevice) —3.5

CypressCypressSemiconductor

賽普拉斯賽普拉斯半導(dǎo)體公司

CY7C1327G-166AXC

4-Mbit (256K x 18) Pipelined Sync SRAM

Features ?Registeredinputsandoutputsforpipelinedoperation ?256K×18commonI/Oarchitecture ?3.3Vcorepowersupply ?3.3V/2.5VI/Ooperation ?Fastclock-to-outputtimes —2.6ns(for250-MHzdevice) —2.6ns(for225-MHzdevice) —2.8ns(for200-MHzdevice) —3.5

CypressCypressSemiconductor

賽普拉斯賽普拉斯半導(dǎo)體公司

CY7C1327G-166AXI

4-Mbit (256K x 18) Pipelined Sync SRAM

Features ?Registeredinputsandoutputsforpipelinedoperation ?256K×18commonI/Oarchitecture ?3.3Vcorepowersupply ?3.3V/2.5VI/Ooperation ?Fastclock-to-outputtimes —2.6ns(for250-MHzdevice) —2.6ns(for225-MHzdevice) —2.8ns(for200-MHzdevice) —3.5

CypressCypressSemiconductor

賽普拉斯賽普拉斯半導(dǎo)體公司

CY7C1327G-166BGC

4-Mbit (256K x 18) Pipelined Sync SRAM

Features ?Registeredinputsandoutputsforpipelinedoperation ?256K×18commonI/Oarchitecture ?3.3Vcorepowersupply ?3.3V/2.5VI/Ooperation ?Fastclock-to-outputtimes —2.6ns(for250-MHzdevice) —2.6ns(for225-MHzdevice) —2.8ns(for200-MHzdevice) —3.5

CypressCypressSemiconductor

賽普拉斯賽普拉斯半導(dǎo)體公司

CY7C1327G-166BGI

4-Mbit (256K x 18) Pipelined Sync SRAM

Features ?Registeredinputsandoutputsforpipelinedoperation ?256K×18commonI/Oarchitecture ?3.3Vcorepowersupply ?3.3V/2.5VI/Ooperation ?Fastclock-to-outputtimes —2.6ns(for250-MHzdevice) —2.6ns(for225-MHzdevice) —2.8ns(for200-MHzdevice) —3.5

CypressCypressSemiconductor

賽普拉斯賽普拉斯半導(dǎo)體公司

CY7C1327G-166BGXC

4-Mbit (256K x 18) Pipelined Sync SRAM

Features ?Registeredinputsandoutputsforpipelinedoperation ?256K×18commonI/Oarchitecture ?3.3Vcorepowersupply ?3.3V/2.5VI/Ooperation ?Fastclock-to-outputtimes —2.6ns(for250-MHzdevice) —2.6ns(for225-MHzdevice) —2.8ns(for200-MHzdevice) —3.5

CypressCypressSemiconductor

賽普拉斯賽普拉斯半導(dǎo)體公司

CY7C1327G-166BGXI

4-Mbit (256K x 18) Pipelined Sync SRAM

Features ?Registeredinputsandoutputsforpipelinedoperation ?256K×18commonI/Oarchitecture ?3.3Vcorepowersupply ?3.3V/2.5VI/Ooperation ?Fastclock-to-outputtimes —2.6ns(for250-MHzdevice) —2.6ns(for225-MHzdevice) —2.8ns(for200-MHzdevice) —3.5

CypressCypressSemiconductor

賽普拉斯賽普拉斯半導(dǎo)體公司

詳細(xì)參數(shù)

  • 型號(hào):

    CY7C1327G

  • 功能描述:

    靜態(tài)隨機(jī)存取存儲(chǔ)器 256Kx18 3.3V IND Sync FT 靜態(tài)隨機(jī)存取存儲(chǔ)器

  • RoHS:

  • 制造商:

    Cypress Semiconductor

  • 存儲(chǔ)容量:

    16 Mbit

  • 組織:

    1 M x 16

  • 訪問時(shí)間:

    55 ns

  • 電源電壓-最大:

    3.6 V

  • 電源電壓-最?。?/span>

    2.2 V

  • 最大工作電流:

    22 uA

  • 最大工作溫度:

    + 85 C

  • 最小工作溫度:

    - 40 C

  • 安裝風(fēng)格:

    SMD/SMT

  • 封裝/箱體:

    TSOP-48

  • 封裝:

    Tray

供應(yīng)商型號(hào)品牌批號(hào)封裝庫存備注價(jià)格
Cypress
TQFP
1200
Cypress一級(jí)分銷,原裝原盒原包裝!
詢價(jià)
CYPRESS
24+
106
詢價(jià)
CYRESS
24+
TQFP
6980
原裝現(xiàn)貨,可開13%稅票
詢價(jià)
CYP
23+
貼片
5000
原裝正品,假一罰十
詢價(jià)
CYPRESS
24+
100%原裝
1500
原裝進(jìn)口現(xiàn)貨
詢價(jià)
Cypress
16+
原廠封裝
10000
全新原裝正品,代理優(yōu)勢渠道供應(yīng),歡迎來電咨詢
詢價(jià)
CYPRESS
22+
QFP
2000
原裝正品現(xiàn)貨
詢價(jià)
CYP
23+
QFP
8560
受權(quán)代理!全新原裝現(xiàn)貨特價(jià)熱賣!
詢價(jià)
CYPRESS
23+
304
專做原裝正品,假一罰百!
詢價(jià)
CYPRESS
22+23+
QFP
43810
絕對原裝正品全新進(jìn)口深圳現(xiàn)貨
詢價(jià)
更多CY7C1327G供應(yīng)商 更新時(shí)間2024-12-28 16:20:00