首頁(yè)>DS34T108GN+>規(guī)格書(shū)詳情

DS34T108GN+集成電路(IC)的專(zhuān)用IC規(guī)格書(shū)PDF中文資料

DS34T108GN+
廠商型號(hào)

DS34T108GN+

參數(shù)屬性

DS34T108GN+ 封裝/外殼為484-BGA 裸露焊盤(pán);包裝為托盤(pán);類(lèi)別為集成電路(IC)的專(zhuān)用IC;DS34T108GN+應(yīng)用范圍:數(shù)據(jù)傳輸;產(chǎn)品描述:IC TDM 484HSBGA

功能描述

Single/Dual/Quad/Octal TDM-Over-Packet Chip

封裝外殼

484-BGA 裸露焊盤(pán)

文件大小

803.77 Kbytes

頁(yè)面數(shù)量

74 頁(yè)

生產(chǎn)廠商 Maxim Integrated Products
企業(yè)簡(jiǎn)稱(chēng)

Maxim美信

中文名稱(chēng)

美信半導(dǎo)體官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

更新時(shí)間

2025-2-13 0:45:00

DS34T108GN+規(guī)格書(shū)詳情

General Description

These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial stream to be transported transparently over IP, MPLS or Ethernet networks. Jitter and wander of recovered clocks conform to G.823/G.824, G.8261, and TDM specifications. TDM data is transported in up to 64 individually configurable bundles. All standards based TDM-over-packet mapping methods are supported except AAL2. Frame-based serial HDLC data flows are also supported. With built-in full featured E1/T1 framers and LIUs. These ICs encapsulate the TDM-over-packet solution from analog E1/T1 signal to Ethernet MII while preserving options to make use of TDM streams at key intermediate points. The high level of integration available with the DS34T10x devices minimizes cost, board space, and time to market.

Features

? Full-Featured IC Includes E1/T1 LIUs and Framers, TDMoP Engine, and 10/100 MAC

? Transport of E1, T1, E3, T3 or STS-1 TDM or CBR Serial Signals Over Packet Networks

? Full Support for These Mapping Methods: SAToP, CESoPSN, TDMoIP (AAL1), HDLC, Unstructured, Structured, Structured with CAS

? Adaptive Clock Recovery, Common Clock, External Clock and Loopback Timing Modes

? On-Chip TDM Clock Recovery Machines, One Per Port, Independently Configurable

? Clock Recovery Algorithm Handles Network PDV, Packet Loss, Constant Delay Changes, Frequency Changes and Other Impairments

? 64 Independent Bundles/Connections

? Multiprotocol Encapsulation Supports IPv4, IPv6, UDP, RTP, L2TPv3, MPLS, Metro Ethernet

? VLAN Support According to 802.1p and 802.1Q

? 10/100 Ethernet MAC Supports MII/RMII/SSMII

? Selectable 32-Bit, 16-Bit or SPI Processor Bus

? Operates from Only Two Clock Signals, One for Clock Recovery and One for Packet Processing

? Glueless SDRAM Buffer Management

? Low-Power 1.8V Core, 3.3V I/O

Applications

? TDM Circuit Extension Over PSN

???? o Leased-Line Services Over PSN

???? o TDM Over GPON/EPON

???? o TDM Over Cable

???? o TDM Over Wireless

? Cellular Backhaul Over PSN

? Multiservice Over Unified PSN

? HDLC-Based Traffic Transport Over PSN

?

產(chǎn)品屬性

  • 產(chǎn)品編號(hào):

    DS34T108GN+

  • 制造商:

    Analog Devices Inc./Maxim Integrated

  • 類(lèi)別:

    集成電路(IC) > 專(zhuān)用 IC

  • 包裝:

    托盤(pán)

  • 類(lèi)型:

    TDM(分時(shí)復(fù)用)

  • 應(yīng)用:

    數(shù)據(jù)傳輸

  • 安裝類(lèi)型:

    表面貼裝型

  • 封裝/外殼:

    484-BGA 裸露焊盤(pán)

  • 供應(yīng)商器件封裝:

    484-PBGA-HS(23x23)

  • 描述:

    IC TDM 484HSBGA

供應(yīng)商 型號(hào) 品牌 批號(hào) 封裝 庫(kù)存 備注 價(jià)格
MAX
1603+
484HSBGA
445
一級(jí)代理,專(zhuān)注軍工、汽車(chē)、醫(yī)療、工業(yè)、新能源、電力
詢(xún)價(jià)
MAXIM
2016+
BGA
6000
只做原裝,假一罰十,公司可開(kāi)17%增值稅發(fā)票!
詢(xún)價(jià)
DALLAS
2020+
BGA
8000
只做自己庫(kù)存,全新原裝進(jìn)口正品假一賠百,可開(kāi)13%增
詢(xún)價(jià)
MAXIM/美信
2023+
HSBGA-484
6000
全新原裝深圳倉(cāng)庫(kù)現(xiàn)貨有單必成
詢(xún)價(jià)
MAXIM/美信
24+
BGA484
11360
ADI優(yōu)勢(shì)主營(yíng)型號(hào)-原裝正品
詢(xún)價(jià)
Maxim(美信)
23+
NA
20094
正納10年以上分銷(xiāo)經(jīng)驗(yàn)原裝進(jìn)口正品做服務(wù)做口碑有支持
詢(xún)價(jià)
MAXIM
24+
BGA
56000
公司進(jìn)口原裝現(xiàn)貨 批量特價(jià)支持
詢(xún)價(jià)
MAXIM
23+
484-BGA
7750
全新原裝優(yōu)勢(shì)
詢(xún)價(jià)
DALLAS
2223+
BGA
26800
只做原裝正品假一賠十為客戶(hù)做到零風(fēng)險(xiǎn)
詢(xún)價(jià)
MAXIM/美信
21+
HSBGA-484
26680
公司只做原裝,誠(chéng)信經(jīng)營(yíng)
詢(xún)價(jià)