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DS34T108GN集成電路(IC)的專用IC規(guī)格書PDF中文資料

DS34T108GN
廠商型號

DS34T108GN

參數屬性

DS34T108GN 封裝/外殼為484-BGA 裸露焊盤;包裝為卷帶(TR)剪切帶(CT)Digi-Reel? 得捷定制卷帶;類別為集成電路(IC)的專用IC;DS34T108GN應用范圍:數據傳輸;產品描述:IC TDM 484HSBGA

功能描述

Single/Dual/Quad/Octal TDM-Over-Packet Chip

封裝外殼

484-BGA 裸露焊盤

文件大小

803.77 Kbytes

頁面數量

74

生產廠商 Maxim Integrated Products
企業(yè)簡稱

Maxim美信

中文名稱

美信半導體官網

原廠標識
數據手冊

下載地址一下載地址二到原廠下載

更新時間

2025-3-21 20:00:00

人工找貨

DS34T108GN價格和庫存,歡迎聯系客服免費人工找貨

DS34T108GN規(guī)格書詳情

General Description

These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial stream to be transported transparently over IP, MPLS or Ethernet networks. Jitter and wander of recovered clocks conform to G.823/G.824, G.8261, and TDM specifications. TDM data is transported in up to 64 individually configurable bundles. All standards based TDM-over-packet mapping methods are supported except AAL2. Frame-based serial HDLC data flows are also supported. With built-in full featured E1/T1 framers and LIUs. These ICs encapsulate the TDM-over-packet solution from analog E1/T1 signal to Ethernet MII while preserving options to make use of TDM streams at key intermediate points. The high level of integration available with the DS34T10x devices minimizes cost, board space, and time to market.

Features

? Full-Featured IC Includes E1/T1 LIUs and Framers, TDMoP Engine, and 10/100 MAC

? Transport of E1, T1, E3, T3 or STS-1 TDM or CBR Serial Signals Over Packet Networks

? Full Support for These Mapping Methods: SAToP, CESoPSN, TDMoIP (AAL1), HDLC, Unstructured, Structured, Structured with CAS

? Adaptive Clock Recovery, Common Clock, External Clock and Loopback Timing Modes

? On-Chip TDM Clock Recovery Machines, One Per Port, Independently Configurable

? Clock Recovery Algorithm Handles Network PDV, Packet Loss, Constant Delay Changes, Frequency Changes and Other Impairments

? 64 Independent Bundles/Connections

? Multiprotocol Encapsulation Supports IPv4, IPv6, UDP, RTP, L2TPv3, MPLS, Metro Ethernet

? VLAN Support According to 802.1p and 802.1Q

? 10/100 Ethernet MAC Supports MII/RMII/SSMII

? Selectable 32-Bit, 16-Bit or SPI Processor Bus

? Operates from Only Two Clock Signals, One for Clock Recovery and One for Packet Processing

? Glueless SDRAM Buffer Management

? Low-Power 1.8V Core, 3.3V I/O

Applications

? TDM Circuit Extension Over PSN

???? o Leased-Line Services Over PSN

???? o TDM Over GPON/EPON

???? o TDM Over Cable

???? o TDM Over Wireless

? Cellular Backhaul Over PSN

? Multiservice Over Unified PSN

? HDLC-Based Traffic Transport Over PSN

?

產品屬性

  • 產品編號:

    DS34T108GN

  • 制造商:

    Analog Devices Inc./Maxim Integrated

  • 類別:

    集成電路(IC) > 專用 IC

  • 包裝:

    卷帶(TR)剪切帶(CT)Digi-Reel? 得捷定制卷帶

  • 類型:

    TDM(分時復用)

  • 應用:

    數據傳輸

  • 安裝類型:

    表面貼裝型

  • 封裝/外殼:

    484-BGA 裸露焊盤

  • 供應商器件封裝:

    484-PBGA-HS(23x23)

  • 描述:

    IC TDM 484HSBGA

供應商 型號 品牌 批號 封裝 庫存 備注 價格
MAXIM/美信
25+
BGA
60
原裝正品,假一罰十!
詢價
MAXIM
13+
BGA484
155
一級代理,專注軍工、汽車、醫(yī)療、工業(yè)、新能源、電力
詢價
Maxim
21+
484HSBGA
13880
公司只售原裝,支持實單
詢價
MAXIM
23+
HSBGA
8888
專做原裝正品,假一罰百!
詢價
MAX
BGA
5350
一級代理 原裝正品假一罰十價格優(yōu)勢長期供貨
詢價
Maxim(美信)
23+
NA
20094
正納10年以上分銷經驗原裝進口正品做服務做口碑有支持
詢價
MAXIM/美信
24+
HSBGA-484
30000
原裝正品公司現貨,假一賠十!
詢價
MAXIM/美信
23+
BGA484
90000
一定原裝房間現貨
詢價
MAXIM
24+
BGA
30617
主打MAXIM品牌價格絕對優(yōu)勢
詢價
MAXIM
23+
NA
25060
只做進口原裝,終端工廠免費送樣
詢價