H5ANAG8NCMR-XXC中文資料ETC數(shù)據(jù)手冊PDF規(guī)格書

FEATURES

? VDD=VDDQ=1.2V +/- 0.06V

? Fully differential clock inputs (CK, CK) operation

? Differential Data Strobe (DQS, DQS)

? On chip DLL align DQ, DQS and DQS transition with CK

transition

? DM masks write data-in at the both rising and falling

edges of the data strobe

? All addresses and control inputs except data, data

strobes and data masks latched on the rising edges of

the clock

? Programmable CAS latency 9, 11, 12, 13, 14, 15, 16,

17 and 18 supported

? Programmable additive latency 0, CL-1, and CL-2

supported

? Programmable CAS Write latency (CWL) = 9, 10, 11,

12, 14, 16

? Programmable burst length 4/8 with both nibble

sequential and interleave mode

? BL switch on the fly

? 16banks

? Average Refresh Cycle (Tcase of 0 oC~ 95 oC)

- 7.8 μs at 0oC ~ 85 oC

- 3.9 μs at 85oC ~ 95 oC

? JEDEC standard 78ball FBGA(x8)

? Driver strength selected by MRS

? Dynamic On Die Termination supported

? Two Termination States such as RTT_PARK and

RTT_NOM switchable by ODT pin

? Asynchronous RESET pin supported

? ZQ calibration supported

? TDQS (Termination Data Strobe) supported

? Write Levelization supported

? 8 bit pre-fetch

? This product in compliance with the RoHS directive.

? Internal Vref DQ level generation is available

? Write CRC is supported at all speed grades

? Maximum Power Saving Mode is supported

? TCAR(Temperature Controlled Auto Refresh) mode is

supported

? LP ASR(Low Power Auto Self Refresh) mode is supported

? Fine Granularity Refresh is supported

? Per DRAM Addressability is supported

? Geardown Mode(1/2 rate, 1/4 rate) is supported

? Programable Preamble for read and write is supported

? Self Refresh Abort is supported

? CA parity (Command/Address Parity) mode is supported

? Bank Grouping is applied, and CAS to CAS latency

(tCCD_L, tCCD_S) for the banks in the same or different

bank group accesses are available

? DBI(Data Bus Inversion) is supported