HMC561LP3RF/IF射頻/中頻RFID的RFIC模塊規(guī)格書(shū)PDF中文資料

HMC561LP3屬于RF/IF射頻/中頻RFID的RFIC模塊。由亞德諾半導(dǎo)體技術(shù)有限公司制造生產(chǎn)的HMC561LP3RF 其它 IC 和模塊RF 其它 IC 和模塊產(chǎn)品系列包含各種獨(dú)特、專(zhuān)門(mén)或特定用途的產(chǎn)品，可與 RF、IF 和微波無(wú)線電應(yīng)用結(jié)合使用。示例包括 AM/FM 調(diào)諧器和接收器、偏置網(wǎng)絡(luò)、基帶處理器、計(jì)數(shù)器、數(shù)字可調(diào)電容器、下變頻器、倍頻器、移相器、前置分頻器、端接器、上變頻器、VCO 等。

General Description

The HMC561LP3(E) is a x2 active broadband frequency multiplier utilizing GaAs PHEMT technology in a leadless RoHS compliant SMT package. When driven by a +5 dBm signal, the multiplier provides +14 dBm typical output power from 8 to 21 GHz and the Fo and 3Fo isolations are 15 dBc at 16 GHz. The HMC561LP3(E) is ideal for use in LO multiplier chains for Pt to Pt & VSAT Radios yielding reduced parts count vs. traditional approaches. The low additive SSB Phase Noise of -139 dBc/Hz at 100 kHz offset helps maintain good system noise performance. The RoHS packaged HMC561LP3(E) eliminates the need for wire bonding, and allows the use of surface mount manufacturing techniques. For availability on NonRoHS compliant HMC561LP3 product please contact Hittite Microwave sales directly.

Features

High Output Power: +14 dBm

Low Input Power Drive: 0 to +6 dBm

Fo Isolation: 15 dBc @ Fout= 16 GHz

100 KHz SSB Phase Noise: -139 dBc/Hz

RoHS Compliant 3x3 mm SMT Package

Typical Applications

The HMC561LP3E are suitable for:

? Clock Generation Applications:

SONET OC-192 & SDH STM-64

? Point-to-Point & VSAT Radios

? Test Instrumentation

? Military & Space