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IRF6612PBF中文資料IRF數(shù)據(jù)手冊(cè)PDF規(guī)格書

IRF6612PBF
廠商型號(hào)

IRF6612PBF

功能描述

RoHs Compliant

文件大小

249.53 Kbytes

頁面數(shù)量

10

生產(chǎn)廠商 International Rectifier
企業(yè)簡稱

IRF

中文名稱

International Rectifier官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

更新時(shí)間

2025-1-18 20:00:00

IRF6612PBF規(guī)格書詳情

Description

The IRF6612PbF combines the latest HEXFET? Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques. Application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80.

? RoHs Compliant

? Lead-Free (Qualified up to 260°C Reflow)

? Application Specific MOSFETs

? Ideal for CPU Core DC-DC Converters

? Low Conduction Losses

? High Cdv/dt Immunity

? Low Profile (<0.7mm)

? Dual Sided Cooling Compatible

? Compatible with existing Surface Mount Techniques

產(chǎn)品屬性

  • 型號(hào):

    IRF6612PBF

  • 制造商:

    IRF

  • 制造商全稱:

    International Rectifier

  • 功能描述:

    RoHs Compliant

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