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IS21SLASH22TF64G中文資料北京矽成數據手冊PDF規(guī)格書

IS21SLASH22TF64G
廠商型號

IS21SLASH22TF64G

功能描述

16GB/32GB/64GB/128GB eMMC With eMMC 5.1 Interface & TLC NAND

文件大小

834.7 Kbytes

頁面數量

36

生產廠商 Integrated Silicon Solution Inc
企業(yè)簡稱

ISSI北京矽成

中文名稱

北京矽成半導體有限公司官網

原廠標識
數據手冊

下載地址一下載地址二

更新時間

2025-5-24 20:00:00

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IS21SLASH22TF64G規(guī)格書詳情

GENERAL DESCRIPTION

ISSI eMMC products follow the JEDEC eMMC 5.1 standard. It is ideal for embedded storage solutions for Industrial application and automotive application, which require high performance across a wide range of operating temperatures. eMMC encloses the TLC Mode NAND and eMMC controller inside as one JEDEC standard package, providing a standard interface to the host. The eMMC controller directly manages NAND flash, including ECC, wear-leveling, IOPS optimization and read sensing.

FEATURES

? Packaged NAND flash memory with eMMC 5.1 interface

- IS21/22TF16G: 16Gigabyte

- IS21/22TF32G: 32Gigabyte

- IS21/22TF64G: 64Gigabyte

- IS21/22TF128G: 128Gigabyte

? Compliant with eMMC Specification Ver.4.3, 4.4, 4.41,4.5, 4.51, 5.0, 5.1

? Device can be converted to eMMC 4.3, 4.41, 4.51, 5.0 via initializing

? Bus mode

- High-speed eMMC protocol

- Clock frequency: 0-200MHz.

- Ten-wire bus (clock, 1 bit command, 8 bit data bus) and a hardware reset.

? Supports three different data bus widths : 1 bit(default), 4 bits, 8 bits

- Data transfer rate: up to 52Mbyte/s (using 8 parallel data lines at 52 MHz)

- Single data rate : up to 200Mbyte/s @ 200MHz (HS200)

- Dual data rate : up to 400Mbyte/s @ 200MHz (HS400)

? Operating voltage range :

- VCCQ = 1.8 V/3.3 V (Automotive A2 Grade only supports 1.8V VCCQ)

- VCC = 2.7 – 3.6V

? Error free memory access

- Internal error correction code (ECC) to protect data communication

- Internal enhanced data management algorithm

- Solid protection from sudden power failure, safe-update operations for data content

? Security

- Support secure erase and trim commands

- Enhanced write protection with permanent and partial protection options

? Key Features :

- HS400, Field Firmware Update (FFU), Power Off Notification, Pre EOL information, Enhanced Device Life

time, Optimal Size

? eMMC 5.1 Features:

- Command Queuing, Enhanced Strobe, Cache Flushing Report, BKOPS Control, Cache Barrier, RPMB

Throughput Improve, Secure Write Protection.

? Temperature range

- Industrial Grade (I): -40 ℃ ~ 85 ℃

- Automotive Grade (A1): -40 ℃ ~ 85 ℃

- Automotive Grade (A2): -40 ℃ ~ 105 ℃ (The Surface Temperature of Tc cannot be over 115 ℃)

? Package

- 153 FBGA (11.5mm x 13mm x 1.0mm)

- 100 FBGA (14.0mm x 18.0mm x 1.4mm)

供應商 型號 品牌 批號 封裝 庫存 備注 價格
ISOCOM
25+
DIPSOP
65248
百分百原裝現(xiàn)貨 實單必成
詢價
TOSHIBA/東芝
12+
DIP
8000
一級代理,專注軍工、汽車、醫(yī)療、工業(yè)、新能源、電力
詢價
ISSI
23+
BGA
4500
ISSI存儲芯片在售
詢價
23+
28000
原裝正品
詢價
24+
32000
全新原廠原裝正品現(xiàn)貨,低價出售,實單可談
詢價
ISSI
24+
DIP16
300
詢價
ISSI Integrated Silicon Soluti
23+/24+
153-VFBGA
8600
只供原裝進口公司現(xiàn)貨+可訂貨
詢價
ISSI
23+
DIP28
5000
原裝正品,假一罰十
詢價
ACECOM
NA
8560
一級代理 原裝正品假一罰十價格優(yōu)勢長期供貨
詢價
ISOCOM
23+
DIP SOP
4674
一級代理原廠VIP渠道,專注軍工、汽車、醫(yī)療、工業(yè)、
詢價