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IS21SLASH22TF64G中文資料北京矽成數據手冊PDF規(guī)格書
IS21SLASH22TF64G規(guī)格書詳情
GENERAL DESCRIPTION
ISSI eMMC products follow the JEDEC eMMC 5.1 standard. It is ideal for embedded storage solutions for Industrial application and automotive application, which require high performance across a wide range of operating temperatures. eMMC encloses the TLC Mode NAND and eMMC controller inside as one JEDEC standard package, providing a standard interface to the host. The eMMC controller directly manages NAND flash, including ECC, wear-leveling, IOPS optimization and read sensing.
FEATURES
? Packaged NAND flash memory with eMMC 5.1 interface
- IS21/22TF16G: 16Gigabyte
- IS21/22TF32G: 32Gigabyte
- IS21/22TF64G: 64Gigabyte
- IS21/22TF128G: 128Gigabyte
? Compliant with eMMC Specification Ver.4.3, 4.4, 4.41,4.5, 4.51, 5.0, 5.1
? Device can be converted to eMMC 4.3, 4.41, 4.51, 5.0 via initializing
? Bus mode
- High-speed eMMC protocol
- Clock frequency: 0-200MHz.
- Ten-wire bus (clock, 1 bit command, 8 bit data bus) and a hardware reset.
? Supports three different data bus widths : 1 bit(default), 4 bits, 8 bits
- Data transfer rate: up to 52Mbyte/s (using 8 parallel data lines at 52 MHz)
- Single data rate : up to 200Mbyte/s @ 200MHz (HS200)
- Dual data rate : up to 400Mbyte/s @ 200MHz (HS400)
? Operating voltage range :
- VCCQ = 1.8 V/3.3 V (Automotive A2 Grade only supports 1.8V VCCQ)
- VCC = 2.7 – 3.6V
? Error free memory access
- Internal error correction code (ECC) to protect data communication
- Internal enhanced data management algorithm
- Solid protection from sudden power failure, safe-update operations for data content
? Security
- Support secure erase and trim commands
- Enhanced write protection with permanent and partial protection options
? Key Features :
- HS400, Field Firmware Update (FFU), Power Off Notification, Pre EOL information, Enhanced Device Life
time, Optimal Size
? eMMC 5.1 Features:
- Command Queuing, Enhanced Strobe, Cache Flushing Report, BKOPS Control, Cache Barrier, RPMB
Throughput Improve, Secure Write Protection.
? Temperature range
- Industrial Grade (I): -40 ℃ ~ 85 ℃
- Automotive Grade (A1): -40 ℃ ~ 85 ℃
- Automotive Grade (A2): -40 ℃ ~ 105 ℃ (The Surface Temperature of Tc cannot be over 115 ℃)
? Package
- 153 FBGA (11.5mm x 13mm x 1.0mm)
- 100 FBGA (14.0mm x 18.0mm x 1.4mm)
供應商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
---|---|---|---|---|---|---|---|
ISOCOM |
25+ |
DIPSOP |
65248 |
百分百原裝現(xiàn)貨 實單必成 |
詢價 | ||
TOSHIBA/東芝 |
12+ |
DIP |
8000 |
一級代理,專注軍工、汽車、醫(yī)療、工業(yè)、新能源、電力 |
詢價 | ||
ISSI |
23+ |
BGA |
4500 |
ISSI存儲芯片在售 |
詢價 | ||
23+ |
28000 |
原裝正品 |
詢價 | ||||
24+ |
32000 |
全新原廠原裝正品現(xiàn)貨,低價出售,實單可談 |
詢價 | ||||
ISSI |
24+ |
DIP16 |
300 |
詢價 | |||
ISSI Integrated Silicon Soluti |
23+/24+ |
153-VFBGA |
8600 |
只供原裝進口公司現(xiàn)貨+可訂貨 |
詢價 | ||
ISSI |
23+ |
DIP28 |
5000 |
原裝正品,假一罰十 |
詢價 | ||
ACECOM |
NA |
8560 |
一級代理 原裝正品假一罰十價格優(yōu)勢長期供貨 |
詢價 | |||
ISOCOM |
23+ |
DIP SOP |
4674 |
一級代理原廠VIP渠道,專注軍工、汽車、醫(yī)療、工業(yè)、 |
詢價 |