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IS61NLP25672-250B1I集成電路(IC)的存儲(chǔ)器規(guī)格書PDF中文資料

IS61NLP25672-250B1I
廠商型號(hào)

IS61NLP25672-250B1I

參數(shù)屬性

IS61NLP25672-250B1I 封裝/外殼為209-BGA;包裝為托盤;類別為集成電路(IC)的存儲(chǔ)器;產(chǎn)品描述:IC SRAM 18MBIT PARALLEL 209LFBGA

功能描述

256K x 72, 512K x 36 and 1M x 18 18Mb, PIPELINE (NO WAIT) STATE BUS SRAM

封裝外殼

209-BGA

文件大小

277.54 Kbytes

頁面數(shù)量

35

生產(chǎn)廠商 Integrated Silicon Solution Inc
企業(yè)簡(jiǎn)稱

ISSI北京矽成

中文名稱

北京矽成半導(dǎo)體有限公司官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二

更新時(shí)間

2025-1-21 16:30:00

IS61NLP25672-250B1I規(guī)格書詳情

DESCRIPTION

The 18 Meg NLP/NVP product family feature high-speed, low-power synchronous static RAMs designed to provide a burstable, high-performance, no wait state, device for networking and communications applications. They are organized as 256K words by 72 bits, 512K words by 36 bits and 1M words by 18 bits, fabricated with ISSIs advanced CMOS technology.

FEATURES

? 100 percent bus utilization

? No wait cycles between Read and Write

? Internal self-timed write cycle

? Individual Byte Write Control

? Single R/W (Read/Write) control pin

? Clock controlled, registered address, data and control

? Interleaved or linear burst sequence control using MODE input

? Three chip enables for simple depth expansion and address pipelining

? Power Down mode

? Common data inputs and data outputs

? CKE pin to enable clock and suspend operation

? JEDEC 100-pin TQFP, 165-ball PBGA and 209- ball (x72) PBGA packages

? Power supply:

NVP: VDD 2.5V (± 5), VDDQ 2.5V (± 5)

NLP: VDD 3.3V (± 5), VDDQ 3.3V/2.5V (± 5)

? JTAG Boundary Scan for PBGA packages

? Industrial temperature available

? Lead-free available

產(chǎn)品屬性

  • 產(chǎn)品編號(hào):

    IS61NLP25672-250B1I

  • 制造商:

    ISSI, Integrated Silicon Solution Inc

  • 類別:

    集成電路(IC) > 存儲(chǔ)器

  • 包裝:

    托盤

  • 存儲(chǔ)器類型:

    易失

  • 存儲(chǔ)器格式:

    SRAM

  • 技術(shù):

    SRAM - 同步,SDR

  • 存儲(chǔ)容量:

    18Mb(256K x 72)

  • 存儲(chǔ)器接口:

    并聯(lián)

  • 電壓 - 供電:

    3.135V ~ 3.465V

  • 工作溫度:

    -40°C ~ 85°C(TA)

  • 安裝類型:

    表面貼裝型

  • 封裝/外殼:

    209-BGA

  • 供應(yīng)商器件封裝:

    209-LFBGA(14x22)

  • 描述:

    IC SRAM 18MBIT PARALLEL 209LFBGA

供應(yīng)商 型號(hào) 品牌 批號(hào) 封裝 庫存 備注 價(jià)格
ISSI
1733+
BGA
6528
只做進(jìn)口原裝正品假一賠十!
詢價(jià)
ISSI
22+
TQFP
5000
全新原裝現(xiàn)貨!自家?guī)齑?
詢價(jià)
ISSI
BGA
68900
原包原標(biāo)簽100%進(jìn)口原裝常備現(xiàn)貨!
詢價(jià)
ISSI Integrated Silicon Soluti
22+
100TQFP (14x20)
9000
原廠渠道,現(xiàn)貨配單
詢價(jià)
ISSI/芯成
22+
BGA
17700
原裝正品
詢價(jià)
ISSI, Integrated Silicon Solu
23+
209-LFBGA14x22
7300
專注配單,只做原裝進(jìn)口現(xiàn)貨
詢價(jià)
ISSI, Integrated Silicon Solu
23+
209-LFBGA14x22
7300
專注配單,只做原裝進(jìn)口現(xiàn)貨
詢價(jià)
ISSIINTEGRATEDSILICONSOLUTIONI
2021+
SMD
100500
一級(jí)代理專營(yíng)品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長(zhǎng)期排單到貨
詢價(jià)
ISSI
22+
BGA
20000
保證原裝正品,假一陪十
詢價(jià)
ISSI
1923+
TQFP
8200
萊克訊原廠貨源每一片都來自原廠原裝現(xiàn)貨薄利多
詢價(jià)