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IS61NVP102418-200B3I集成電路(IC)的存儲(chǔ)器規(guī)格書PDF中文資料

IS61NVP102418-200B3I
廠商型號(hào)

IS61NVP102418-200B3I

參數(shù)屬性

IS61NVP102418-200B3I 封裝/外殼為165-TBGA;包裝為托盤;類別為集成電路(IC)的存儲(chǔ)器;產(chǎn)品描述:IC SRAM 18MBIT PARALLEL 165TFBGA

功能描述

256K x 72, 512K x 36 and 1M x 18 18Mb, PIPELINE (NO WAIT) STATE BUS SRAM

封裝外殼

165-TBGA

文件大小

277.54 Kbytes

頁面數(shù)量

35

生產(chǎn)廠商 Integrated Silicon Solution Inc
企業(yè)簡(jiǎn)稱

ISSI北京矽成

中文名稱

北京矽成半導(dǎo)體有限公司官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

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更新時(shí)間

2025-2-8 16:53:00

IS61NVP102418-200B3I規(guī)格書詳情

DESCRIPTION

The 18 Meg NLP/NVP product family feature high-speed, low-power synchronous static RAMs designed to provide a burstable, high-performance, no wait state, device for networking and communications applications. They are organized as 256K words by 72 bits, 512K words by 36 bits and 1M words by 18 bits, fabricated with ISSIs advanced CMOS technology.

FEATURES

? 100 percent bus utilization

? No wait cycles between Read and Write

? Internal self-timed write cycle

? Individual Byte Write Control

? Single R/W (Read/Write) control pin

? Clock controlled, registered address, data and control

? Interleaved or linear burst sequence control using MODE input

? Three chip enables for simple depth expansion and address pipelining

? Power Down mode

? Common data inputs and data outputs

? CKE pin to enable clock and suspend operation

? JEDEC 100-pin TQFP, 165-ball PBGA and 209- ball (x72) PBGA packages

? Power supply:

NVP: VDD 2.5V (± 5), VDDQ 2.5V (± 5)

NLP: VDD 3.3V (± 5), VDDQ 3.3V/2.5V (± 5)

? JTAG Boundary Scan for PBGA packages

? Industrial temperature available

? Lead-free available

產(chǎn)品屬性

  • 產(chǎn)品編號(hào):

    IS61NVP102418-200B3I

  • 制造商:

    ISSI, Integrated Silicon Solution Inc

  • 類別:

    集成電路(IC) > 存儲(chǔ)器

  • 包裝:

    托盤

  • 存儲(chǔ)器類型:

    易失

  • 存儲(chǔ)器格式:

    SRAM

  • 技術(shù):

    SRAM - 同步,SDR

  • 存儲(chǔ)容量:

    18Mb(1M x 18)

  • 存儲(chǔ)器接口:

    并聯(lián)

  • 電壓 - 供電:

    2.375V ~ 2.625V

  • 工作溫度:

    -40°C ~ 85°C(TA)

  • 安裝類型:

    表面貼裝型

  • 封裝/外殼:

    165-TBGA

  • 供應(yīng)商器件封裝:

    165-TFBGA(13x15)

  • 描述:

    IC SRAM 18MBIT PARALLEL 165TFBGA

供應(yīng)商 型號(hào) 品牌 批號(hào) 封裝 庫存 備注 價(jià)格
ISSI, Integrated Silicon Solu
23+
165-TFBGA13x15
7300
專注配單,只做原裝進(jìn)口現(xiàn)貨
詢價(jià)
ISSI,
21+
25000
原廠原包 深圳現(xiàn)貨 主打品牌 假一賠百 可開票!
詢價(jià)
ISSI Integrated Silicon Soluti
23+/24+
165-TBGA
8600
只供原裝進(jìn)口公司現(xiàn)貨+可訂貨
詢價(jià)
ISSI
22+
BGA165
1368
原裝正品,支持實(shí)單。
詢價(jià)
ISSI, Integrated Silicon Solu
23+
165-TFBGA13x15
7300
專注配單,只做原裝進(jìn)口現(xiàn)貨
詢價(jià)
ISSIINTEGRATEDSILICONSOLUTIONI
2021+
SMD
100500
一級(jí)代理專營(yíng)品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長(zhǎng)期排單到貨
詢價(jià)
ISSI Integrated Silicon Solut
24+
165-TBGA
9350
獨(dú)立分銷商 公司只做原裝 誠(chéng)心經(jīng)營(yíng) 免費(fèi)試樣正品保證
詢價(jià)
ISSI
15+
原裝正品現(xiàn)貨
10
BGA165
詢價(jià)
ISSI, Integrated Silicon Solut
24+
165-TFBGA(13x15)
56200
一級(jí)代理/放心采購
詢價(jià)
ISSI, Integrated Silicon Solut
21+
BGA
1000
進(jìn)口原裝!長(zhǎng)期供應(yīng)!絕對(duì)優(yōu)勢(shì)價(jià)格(誠(chéng)信經(jīng)營(yíng)
詢價(jià)